CMP Pad Conditioning Using Aerosol Spray Instead of Diamond Tips
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Solution Overview
Problem
Existing substrate polishing methods, particularly chemical mechanical polishing (CMP), face issues with deterioration of conditioning capability due to abrasion of diamond tips, uneven conditioning distribution, and process defects from dislodged diamond tips, leading to reduced productivity in semiconductor manufacturing.
Innovation Solution
A substrate polishing apparatus utilizing an aerosol-based conditioning device that includes a supplier and sprayer to generate and spray aerosol onto the polishing pad, eliminating the need for diamond tip disks, thereby maintaining conditioning capability and improving distribution consistency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If diamond tip disks are used for conditioning the polishing pad, then the polishing pad can be conditioned to maintain polishing performance, but the diamond tips undergo abrasion leading to deterioration of conditioning capability and generation of process defects
Solution Approach 1:
The patent removes the diamond tip disk from the conditioning system and replaces it with an aerosol delivery system. The harmful diamond tips are extracted entirely, eliminating abrasion-related deterioration while maintaining the conditioning function through alternative means (aerosolized conditioning agents).
Solution Approach 2:
The patent replaces the mechanical abrasion-based conditioning system (diamond tip disks) with an aerosol-based chemical/physical conditioning system. The mechanical action of diamond tips is substituted by aerosolization and deposition of conditioning agents, eliminating mechanical wear and tear.
2Manufacturing precision
If diamond tip disks are used for conditioning, then polishing performance can be maintained, but uneven conditioning distribution occurs and diamond tips become dislodged causing process defects
Solution Approach 1:
The patent eliminates the source of harmful factors by removing the diamond tip disk entirely. The aerosol system delivers conditioning agents without generating dislodged particles, thereby eliminating process defects caused by diamond tip deterioration while maintaining polishing quality.
Solution Approach 2:
The patent changes the state of the conditioning medium from solid (diamond tips) to aerosol (fine particles or droplets in gas phase). This parameter change enables uniform distribution of conditioning agents throughout the polishing pad surface, eliminating uneven conditioning while preventing particle dislodgement.
3Duration of action of stationary object
If conventional conditioning methods are used, then the polishing pad can be conditioned, but abrasion of diamond tips leads to reduced durability and productivity
Solution Approach 1:
The patent replaces the mechanical abrasion system with an aerosol delivery system that does not involve mechanical contact. This substitution eliminates wear and tear on conditioning elements, significantly improving durability while maintaining or enhancing productivity through more efficient conditioning.
Solution Approach 2:
The patent changes the physical state and delivery mechanism of conditioning agents from solid diamond tips to aerosol form. This parameter change enables longer-lasting conditioning without mechanical degradation, improving durability and allowing for more efficient manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The aerosol-based conditioning enhances the polishing apparatus's durability and productivity by preventing diamond tip abrasion-related issues, ensuring consistent conditioning and reducing process defects, thus improving semiconductor manufacturing efficiency.
Implementation Method 1
a sprayer connected to the supplier and configured to generate aerosol from the source material
Data Source
AI summary
Provided is a substrate polishing apparatus including a polishing pad, a head portion configured to move a substrate to contact the polishing pad, and a conditioning device on the polishing pad in a vertical direction and spaced apart from the polishing pad, wherein the conditioning device includes a supplier configured to produce a source material, and a sprayer connected to the supplier and configured to generate aerosol from the source material, and wherein the sprayer includes a low pressure chamber, and a spray nozzle configured to spray the aerosol to the polishing pad.


