CMP Pad Conditioner Segmented Diamond Tips

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Solution Overview

Problem

Conventional CMP pad conditioners face issues with productivity due to slow diamond deposition rates and the brittleness of diamond cutting tip patterns, leading to instability and detachment during polishing, which results in scratches and metal ion contamination.

Innovation Solution

A CMP pad conditioner with cutting tip patterns formed on a substrate, where diamond deposition tip portions are combined with substrate tip portions of varying heights and thicknesses, using a CVD process optimized for faster deposition and enhanced mechanical stability, and a diamond coating layer for durability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If diamond deposition is performed using conventional CVD process, then cutting tip patterns are formed, but deposition time is excessively long reducing productivity

Engineering Contradiction:

Improvecutting tip pattern formationVSAvoiddeposition time

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The cutting tip pattern is divided into two segments: substrate tip portions (providing mechanical strength) and diamond deposition tip portions (providing cutting function). This segmentation allows the diamond layer to be deposited only on the tip portions rather than the entire substrate, significantly reducing deposition time while maintaining pattern formation quality

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Diamond deposition is applied locally only to the tip portions of the substrate rather than uniformly across the entire substrate surface. This local quality approach reduces the total deposition area and time while ensuring diamond particles are present only where cutting action is required

Inventive Principle:

Principle #3Local quality

2Reliability

If diamond cutting tip patterns are used, then cutting performance is improved, but brittleness causes detachment and instability during polishing

Engineering Contradiction:

Improvecutting performanceVSAvoidmechanical stability

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The cutting tip pattern is formed as a composite structure combining substrate material (providing mechanical strength and stability) with diamond deposition (providing superior cutting performance). This composite approach allows each material to contribute its advantageous properties while compensating for the weaknesses of the other

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The cutting tip pattern is segmented into substrate tip portions that remain as the base structure providing mechanical stability, and diamond deposition tip portions that are applied only where needed for cutting. This segmentation prevents the entire pattern from being brittle while maintaining cutting effectiveness at the tips

Inventive Principle:

Principle #1Segmentation

3Reliability

If diamond particles detach during polishing, then cutting function is maintained, but detached particles cause scratches and metal ion contamination

Engineering Contradiction:

Improvecutting functionVSAvoidscratches and contamination

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The composite structure of substrate and diamond deposition creates a more stable configuration where diamond particles are firmly anchored to the substrate. This reduces particle detachment during polishing while maintaining the cutting function, thereby preventing scratches and metal ion contamination from detached particles

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The substrate tip portions serve as a stable base that prevents diamond particles from detaching during the polishing process. This prior cushioning approach ensures that diamond particles remain firmly in place throughout operation, preventing the harmful effects of particle detachment before they can occur

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution significantly reduces deposition time, increases productivity, ensures the strength and stability of cutting tip patterns, and effectively removes debris and sludge during conditioning, preventing scratches and metal ion contamination.

Implementation Method 1

using a CVD process optimized for faster deposition and enhanced mechanical stability

Methodology Applied

Scientific EffectChemical Vapor Deposition: Chemical Vapour Deposition

Data Source

PatentUS10166653B2CMP pad conditioner

Publication Date: 2019.01.01 NIWA DAIYAMONDO INDS

AI summary

The present invention relates to a CMP pad conditioner having a substrate and a cutting tip pattern formed on at least one surface of the substrate, and more particularly to a CMP pad conditioner having cutting tip patterns, in which the cutting tip patterns have an improved structure that can increase the productivity of the CMP pad conditioner and that can sufficiently ensure the strength and safety of the cutting tip patterns.