CMP Polishing Pad Crosslinking Control for Rate and Pad Cut
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Solution Overview
Problem
The existing polishing pads used in the CMP process for semiconductor manufacturing lack effective control over polishing rate and pad cut rate, despite attempts to improve their composition and physical properties.
Innovation Solution
A polishing pad with a porous polyurethane-based resin polishing layer having a swelling ratio of 100% to 350% in dimethylformamide (DMF) is developed, where the crosslinking density is adjusted by controlling the preheating temperature of the mold during the curing process, enhancing the CMP performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the composition and physical properties of raw materials are adjusted, then the performance of polishing pad is improved, but the control over polishing rate and pad cut rate is not effective
Solution Approach 1:
The patent applies parameter changes by adjusting the crosslinking density of the polyurethane resin through modified chemical composition (using specific diisocyanates and polyols in a defined ratio) and curing conditions (temperature and time parameters). This directly controls the swelling ratio in DMF, which in turn effectively regulates the polishing rate and pad cut rate, resolving the inability to control these parameters through conventional composition adjustments alone.
2Productivity
If the crosslinking density is adjusted, then the polishing rate and cut pad rate are improved, but the manufacturing process complexity increases
Solution Approach 1:
The patent applies preliminary action by pre-calculating and optimizing the chemical composition ratios (specific diisocyanate and polyol combinations) and predetermined curing parameters (temperature and time) before production. This allows the crosslinking density to be controlled through standardized formulation and process parameters rather than complex real-time adjustments, thereby improving productivity while maintaining manageable manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adjusted crosslinking density significantly improves the polishing rate and cut pad rate, enabling the production of semiconductor devices with excellent quality through the CMP process.
Implementation Method 1
the polishing layer has a swelling ratio of 100% to 350% in dimethylformamide (DMF) based on the volume or weight of the polishing layer
Implementation Method 2
injecting the raw material mixture into a mold preheated to a temperature of 50° C. or higher and curing it to obtain a polishing layer
Implementation Method 3
or by generating a gas by a chemical reaction
Implementation Method 4
injecting the raw material mixture into a mold preheated to a temperature of 50° C. or higher
Data Source
AI summary
The present invention provides a polishing pad whose crosslinking density is adjusted to enhance the performance of the CMP process such as polishing rate and cut pad rate. In addition, in the process for preparing a polishing pad according to the embodiment, it is possible to implement such a crosslinking density by a simple method of controlling the preheating temperature of the mold for curing. Thus, the polishing pad may be applied to a process of preparing a semiconductor device, which comprises a CMP process, to provide a semiconductor device such as a wafer of excellent quality.