CMP Pad Formulation Balancing Planarization, Defects, and Removal Rate
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Solution Overview
Problem
Existing CMP polishing pads face a tradeoff between planarization efficiency and defectivity, with high planarization efficiency leading to increased defects and low defectivity resulting in reduced removal rates, and there is a need for a formulation that balances these factors while maintaining mechanical properties.
Innovation Solution
A CMP polishing pad formed from a two-component reaction mixture comprising a liquid aromatic isocyanate component and a liquid polyol component, with a specific ratio of small chain difunctional polyols and aromatic diamine, which provides a flexible formulation window for improved planarization efficiency and reduced defectivity without compromising removal rates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If higher concentrations of aromatic diamines are used in CMP polishing pads, then planarization efficiency and mechanical properties are improved, but defectivity increases
Solution Approach 1:
The patent changes the chemical composition parameters by introducing small chain difunctional polyols (12-40 wt%) into the curative mixture with aromatic diamine, creating a balanced formulation that modifies the crosslinking density and network structure to reduce defectivity while preserving planarization efficiency
Solution Approach 2:
The patent creates a composite curative system combining small chain difunctional polyols and aromatic diamine in specific ratios (mole ratio of liquid aromatic diamine to total moles of small chain difunctional polyols and liquid aromatic diamine ranges from 15:85 to 40:60), forming a polyurethane network with optimized properties that balances planarization efficiency and defectivity
2Strength
If higher tensile modulus and hardness are achieved through aromatic diamine concentration, then planarization efficiency improves, but removal rate performance deteriorates
Solution Approach 1:
The patent optimizes the formulation parameters by controlling the concentration of small chain difunctional polyols (12-40 wt%) and the mole ratio of aromatic diamine (15:85 to 40:60), creating a polyurethane network with balanced mechanical properties that achieves both high tensile modulus and adequate removal rate
3Speed
If the curative mixture contains only aromatic diamine, then reaction time is fast and mechanical properties are strong, but planarization efficiency and defectivity balance is poor
Solution Approach 1:
The patent develops a composite curative system combining small chain difunctional polyols and aromatic diamine, where the polyol component (12-40 wt%) provides controlled crosslinking that maintains fast reaction kinetics while improving the balance between planarization efficiency and defectivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The CMP polishing pads achieve enhanced planarization efficiency with reduced defectivity and maintain adequate mechanical properties, such as tensile strength and hardness, while allowing for a higher removal rate, thereby improving the overall performance in polishing processes.
Implementation Method 1
the polyurethane reaction product of a substantially water free and organic solvent free two component reaction mixture comprising (i) a liquid aromatic isocyanate component... and (ii) liquid polyol component
Implementation Method 2
a curative mixture of one or more small chain difunctional polyols... and a liquid aromatic diamine
Data Source
AI summary
CMP polishing pads or layers made from a polyurethane reaction product of a reaction mixture comprising (i) a liquid aromatic isocyanate component comprising one or more aromatic diisocyanates or a linear aromatic isocyanate-terminated urethane prepolymer, and (ii) a liquid polyol component comprising a) one or more polymeric polyols, b) from 12 to 40 wt. %, based on the total weight of the liquid polyol component, of a curative mixture of one or more small chain difunctional polyols having from 2 to 9 carbon atoms, a liquid aromatic diamine, wherein the mole ratio of liquid aromatic diamine to the total moles of small chain difunctional polyols and liquid aromatic diamine ranges from 15:85 to 40:60, wherein, the reaction mixture comprises 48 to 68 wt. % hard segment materials.