CMP Pad Removal Device with Segmented Guide
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Solution Overview
Problem
Current methods for removing CMP pads from surfaces, such as platen surfaces in IC manufacturing, are inefficient and require significant force to overcome the bonding strength, leading to potential damage and increased operational costs.
Innovation Solution
A pad removal device featuring a pad guide with a first and second end, actuated by an actuator and control assembly, which affixes to the pad edges and pulls them away from the center, facilitating separation from the bonded surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If traditional pad removal methods are used, then significant force is required to overcome bonding strength, but this leads to potential damage and increased operational costs
Solution Approach 1:
The invention divides the pad removal process into multiple segments by using a pad guide with multiple contact points (first end, second end, and intermediate portion) that engage different regions of the pad simultaneously. This segmentation distributes the removal force across multiple locations, preventing concentrated stress that could damage the pad while effectively overcoming the bonding strength.
Solution Approach 2:
The pad guide extends in a second direction perpendicular to the pulling direction, creating a multi-dimensional force distribution system. By affixing the pad guide to pad edges at multiple locations and pulling in one direction while the guide extends perpendicularly, the invention transforms a single-point force application into a distributed multi-point force system, reducing damage risk.
2Productivity
If significant force is applied to remove bonded pads, then removal can be achieved, but operational efficiency decreases and costs increase
Solution Approach 1:
By segmenting the force application across multiple contact points of the pad guide, the invention enables more efficient pad removal that requires less total energy. The distributed force system overcomes bonding strength more effectively than concentrated force, improving productivity while reducing energy loss.
Solution Approach 2:
The pad guide acts as an intermediary device between the actuator and the pad, translating the pulling action into distributed force application across multiple pad locations. This intermediary mechanism improves removal efficiency by optimizing force transmission and reducing energy waste through better force distribution.
3Ease of operation
If conventional pad removal methods are used, then simple equipment is required, but the removal process is slow and damaging
Solution Approach 1:
The segmented pad guide structure enables simultaneous engagement with multiple pad regions, allowing the removal process to occur across multiple points at once rather than sequentially. This dramatically reduces the time required for pad removal while maintaining ease of operation through the automated actuator system.
Solution Approach 2:
The pad guide is positioned and affixed to the pad edges before the pulling action begins, preparing the force distribution system in advance. This preliminary positioning ensures that when the actuator activates, the force is immediately and efficiently distributed across multiple contact points, reducing overall removal time.
Data Source
AI summary
A pad removal device includes a pad guide extending along a first direction. The pad guide includes a first affixing component configured to affix a first end of the pad guide to a pad at a first pad location, and a second affixing component configured to affix a second end of the pad guide to the pad at a second pad location different from the first pad location. The pad removal device further includes a first actuator attached to the first end of the pad guide. The pad removal device further includes a control assembly coupled to the actuator, wherein the control assembly is configured to cause the first actuator to move the first end toward the second end along the first direction.