Machined Polymer-Coated CMP Platens for Flat Pad Mounting
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Solution Overview
Problem
Chemical mechanical polishing (CMP) systems face challenges with the deformation of polishing platens due to high-temperature low-adhesion-material coating processes, leading to inconsistent substrate polishing results and increased force required to remove used polishing pads, which can cause injury and damage.
Innovation Solution
A method of manufacturing polishing platens with a cylindrical metal body and a polymer coating layer, where the coating layer is formed with a thickness of 100 μm or more and then machined to achieve a desired flatness or shape, reducing the force needed to remove the polishing pad and maintaining platen flatness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If a low-adhesion-material coating is applied to the polishing platen surface, then the force required to remove the polishing pad is reduced, but the platen surface flatness is degraded due to thermal deformation during coating
Solution Approach 1:
The platen surface is ground to a precise flatness specification (e.g., within 10 microns) before applying the low-adhesion coating. This preliminary precision machining ensures that even after coating application and thermal processing, the final surface maintains the required flatness for consistent CMP results
Solution Approach 2:
The coating application process parameters are controlled and optimized to minimize thermal input to the platen. This may involve using lower cure temperatures, shorter cure times, or alternative coating methods that reduce thermal exposure, thereby minimizing thermal deformation of the platen while still achieving adequate coating adhesion
2Force
If a thick polymer coating is applied to reduce pad removal force, then pad removal becomes easier, but the coating deforms under compressive load during CMP processing
Solution Approach 1:
The polymer coating thickness is precisely controlled within an optimal range (e.g., 25-50 microns) that balances two competing requirements: thick enough to provide sufficient low-adhesion properties for easy pad removal, but thin enough to maintain structural integrity and resist deformation under the high compressive loads encountered during CMP processing
Solution Approach 2:
A multi-layer coating system is employed where a thin, hard, load-bearing layer is applied first to provide structural support and deformation resistance, followed by a thinner low-adhesion layer that provides the pad release functionality. This composite structure allows each layer to optimize its function without compromising the other
3Reliability
If high-temperature processes are used to apply the low adhesion material, then the coating process is effective, but the platen becomes warped and surface flatness is reduced
Solution Approach 1:
The platen surface is pre-treated and precisely ground to specification before coating application. This preliminary preparation creates a stable, flat substrate that can better withstand subsequent thermal processing without excessive warping
Solution Approach 2:
The coating cure temperature and time parameters are optimized to achieve adequate coating performance at the lowest possible temperature. Alternative curing methods such as UV curing or two-component chemical curing at room temperature may be used to eliminate thermal deformation entirely
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method ensures consistent substrate polishing results by maintaining platen flatness and reducing the force required to remove used polishing pads, thereby preventing injury and damage while protecting the platen from corrosion.
Implementation Method 1
removing at least a portion of the polymer layer using the cutting tool to form a polishing pad-mounting surface
Data Source
AI summary
Embodiments of the present disclosure generally relate to methods of manufacturing polishing platens for use on a chemical mechanical polishing (CMP) system and polishing platens formed therefrom. A method of manufacturing a polishing includes positioning a polishing platen on a support of a manufacturing system. The manufacturing system includes the support and a cutting tool facing there towards. Here, the polishing platen includes a cylindrical metal body having a polymer layer disposed on a surface thereof and the polymer layer has a thickness of about 100 μm or more. The method further includes removing at least a portion of the polymer layer using the cutting tool to form a polishing pad-mounting surface. Beneficially, the method may be used to form a pad-mounting surface having a desired flatness or shape, such as a concave or convex shape.