CMP Polishing Body Pore Structure for Grain Retention and Low Drag
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Solution Overview
Problem
Existing abrasive bodies for CMP methods face issues with stable polishing performance and uniformity due to excessive abrasive grain release and high sliding resistance, which can lead to vibration and scratches on large workpieces.
Innovation Solution
An abrasive body with a resin structure and longitudinal pores, where the average diameter of communicating pores is not more than 18 times larger than the abrasive grains, and the presence of longitudinal pores with openings on the polishing surface, reduces sliding resistance and retains abrasive grains effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the diameter of the pores is sufficiently reduced to retain abrasive grains stably, then abrasive grain retention is improved, but negative pressure increases and sliding resistance becomes larger
Solution Approach 1:
The invention divides the pore structure into two distinct types: communicating pores (for abrasive grain retention) and longitudinal pores (for pressure relief). This segmentation allows each pore type to fulfill its specific function without compromising the other, resolving the contradiction between grain retention and sliding resistance.
Solution Approach 2:
The invention utilizes a dual-pore porous structure where communicating pores with controlled diameters retain abrasive grains while longitudinal pores provide pressure relief pathways. This porous material design enables simultaneous achievement of grain stability and reduced sliding resistance.
2Ease of operation
If large pores are formed to reduce sliding resistance, then polishing uniformity is improved, but abrasive grains may not be retained stably
Solution Approach 1:
The invention segments the pore system into communicating pores (small diameter for grain retention) and longitudinal pores (large diameter for pressure relief). This segmentation allows large pores to reduce sliding resistance while small communicating pores ensure stable abrasive grain containment.
Solution Approach 2:
The invention introduces longitudinal pores that extend in the thickness direction, adding a vertical dimension to the pore structure. This dimensional change allows pressure relief without compromising the horizontal grain retention function of communicating pores.
3Ease of operation
If a high amount of water-soluble particles is used to form large pores, then sliding resistance is reduced, but scratches on the workpiece increase
Solution Approach 1:
The invention uses a controlled porous structure formed by water-soluble particles as pore formers, but precisely controls their amount and distribution. The resulting longitudinal pores provide pressure relief while the structured porosity prevents excessive particle release that would cause scratches.
Solution Approach 2:
The invention changes the parameters of pore formation by controlling the amount, size distribution, and spatial arrangement of water-soluble particles. This parameter optimization ensures sufficient longitudinal pores for pressure relief while maintaining abrasive grain retention and preventing workpiece scratches.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves stable polishing performance and uniformity by reducing abrasive grain release and sliding resistance, preventing scratches on workpieces, and enabling smooth polishing of large areas without the need for costly slurry.
Implementation Method 1
the resin structure includes communicating pores each of which communicating with the longitudinal pore and/or communicating with other communicating pore, wherein the communicating pores include at least one of the abrasive grains in the pores respectively
Implementation Method 2
the presence of longitudinal pores formed to extend in a thickness direction in the abrasive body... the average diameter of the communicating pores is not more than 18 times larger than the average diameter of the abrasive grains
Data Source
AI summary
In an abrasive body used for polishing by a CMP method, provided with a resin structure, a plurality of abrasive grains, and a plurality of longitudinal pores, and made in a form of disc, the longitudinal pore has a length in a thickness direction of the abrasive body longer than a length in a planar direction of the abrasive body, the resin structure includes communicating pores each of which communicating with the longitudinal pore and/or communicating with other communicating pore, the communicating pores include at least one of the abrasive grains in the pores respectively, and the average diameter of the communicating pores is not more than 18 times larger than the average diameter of the abrasive grains.