CMP Polishing Composition for Hard Resin Removal Speed
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Solution Overview
Problem
Semiconductor devices with advanced multilayer wiring require increased polishing speed during the CMP process, which is hindered by the use of hard resins like polyimide and epoxy, necessitating a polishing composition that enhances polishing efficiency.
Innovation Solution
A polishing composition comprising alumina abrasive grains and an anionic surfactant with two or more benzene rings, a content of 0.2% or more, and a mass ratio of 1:0.1 or more, with a pH of 2 to 8, to improve the interaction between abrasive grains and resin surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If hard resins like polyimide or epoxy are used for advanced multilayer wiring, then insulation properties are improved, but polishing speed decreases
Solution Approach 1:
The invention changes the chemical composition parameters of the polishing slurry by introducing an anionic surfactant with two or more benzene rings. This surfactant modifies the interaction between alumina abrasive grains and the hard resin surface, enabling effective polishing of polyimide and epoxy resins while maintaining their insulation properties. The specific structural parameter (benzene rings) of the surfactant is critical for achieving both good insulation and high polishing speed.
2Stability of the object's composition
If conventional polishing slurry with single benzene ring surfactant is used, then alumina abrasive grains are supplied evenly to polishing pad, but polishing speed of hard resins is insufficient
Solution Approach 1:
The invention changes the molecular structure parameter of the surfactant from one benzene ring to two or more benzene rings. This structural parameter change enhances the surfactant's ability to interact with hard resin surfaces while maintaining its function of evenly distributing alumina abrasive grains on the polishing pad, thereby achieving both stability and high polishing speed.
Solution Approach 2:
The invention creates a composite polishing slurry system combining alumina abrasive grains with a specifically structured anionic surfactant (having two or more benzene rings). This composite formulation synergistically combines the mechanical polishing action of alumina with the surface-active properties of the multi-benzene ring surfactant, enabling effective polishing of hard resins while maintaining stable abrasive grain distribution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition significantly increases polishing speed and affinity between abrasive grains and resin, enhancing the CMP process efficiency for semiconductor devices and other resin-based materials.
Implementation Method 1
the anionic surfactant has two or more benzene rings... the composition significantly increases polishing speed and affinity between abrasive grains and resin
Data Source
AI summary
Provided is a polishing composition used for polishing a resin, the polishing composition including: water; alumina abrasive grains; and an anionic surfactant, in which the anionic surfactant has two or more benzene rings.