Compact CMP Device with Movable Polishing Pad Arm
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Solution Overview
Problem
The increase in wafer size poses challenges for uniform polishing, particularly at the edges, and results in larger CMP devices that are less miniaturized and more difficult to maintain, with inefficiencies in slurry usage and polishing pad management.
Innovation Solution
A compact CMP device design featuring a smaller polishing pad arm with integrated slurry supply and automatic cleaning and replacement systems, allowing for precise control over polishing and reduced device size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the wafer size is increased to reduce fabrication cost, then the polishing uniformity deteriorates, especially at the edges
Solution Approach 1:
The polishing pad is made movable relative to the wafer through a polishing pad arm that enables relative movement between the polishing pad and wafer surface. This dynamic configuration allows the polishing pad to be positioned and moved to achieve uniform polishing across the entire wafer surface, including edges, thereby resolving the polishing uniformity issue while maintaining large wafer size
Solution Approach 2:
The polishing system is divided into separate functional components: a stationary polishing plate holding the wafer, and a movable polishing pad arm that can be positioned independently. This segmentation allows the polishing pad to be precisely controlled to contact different areas of the large wafer surface, ensuring uniform polishing across the entire area
2Quantity of substance
If the wafer size is increased, then the device size increases, which adversely affects miniaturization and maintenance
Solution Approach 1:
Instead of scaling up the entire polishing device with the wafer size, the invention uses a movable polishing pad arm that can be positioned over large wafers without requiring a proportionally larger polishing plate or device structure. This dynamic positioning system allows the device to maintain a compact size while accommodating larger wafers
Solution Approach 2:
The polishing system separates the wafer holding function (stationary polishing plate) from the polishing function (movable polishing pad arm). This segmentation allows the device to process large wafers without requiring the entire device structure to be scaled up, thereby maintaining device compactness while handling larger substrates
3Productivity
If a traditional polishing apparatus is used, then slurry usage is inefficient and polishing pad management is manual
Solution Approach 1:
The system incorporates automatic polishing pad replacement and slurry supply control that responds to polishing process requirements. The slurry supply route is configured to deliver slurry efficiently to the polishing interface, and the automatic pad replacement system monitors and maintains optimal polishing conditions, reducing slurry waste through precise control
Solution Approach 2:
The polishing system includes automatic polishing pad replacement functionality that performs maintenance tasks without manual intervention. The system self-manages pad replacement and slurry supply optimization, improving operational efficiency and reducing slurry consumption through automated control mechanisms
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and uniform polishing of larger wafers, including edges, while minimizing slurry waste and automating maintenance tasks, thus improving polishing efficiency and reducing costs.
Implementation Method 1
the polishing slurry contacts the surface of the metallic material to form metal oxides
Implementation Method 2
mechanically polished away with relative movement between the surface layer and a polishing pad through abrasives in the polishing slurry
Data Source
AI summary
A polishing apparatus used in chemical mechanical polishing device is provided. The polishing apparatus includes a polishing plate for holding a wafer to be polished; a polishing pad arm, one end of the polishing pad arm being fixed, another end of the polishing pad arm holding a polishing pad, and the polishing pad arm driving the polishing pad for moving relatively to the wafer; the polishing pad moving relatively to the wafer with drive from the polishing pad arm, and the polishing pad arm ensuring the polishing pad contacting the wafer during movement; and a slurry supply route for supplying polishing slurry between the polishing pad and the wafer during polishing. The present invention also provides a chemical mechanical polishing device. It makes for realizing miniaturization of a chemical mechanical polishing device, saving polishing slurry and improving utilization rate of the polishing pad in the chemical mechanical polishing device to apply the present invention.