CMP Polishing Pad Carrier-Compatible Grooves Slurry Distribution

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Solution Overview

Problem

Conventional CMP polishing pads with groove patterns fail to effectively utilize slurry due to the squeegee effect caused by active wafer carrier rings, leading to reduced polishing effectiveness and increased costs.

Innovation Solution

The polishing pad features carrier-compatible grooves that align with the carrier grooves, creating larger flow passages and enhancing slurry distribution, thereby reducing the squeegee effect and improving slurry utilization.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of substance

If conventional groove patterns are used on polishing pads, then the polishing pad structure is simple and easy to manufacture, but slurry distribution is poor due to the squeegee effect from carrier rings

Engineering Contradiction:

Improveslurry consumptionVSAvoidgroove pattern complexity

Core Design Contradiction:

Loss of substanceVSDevice complexity

Solution Approach 1:

The polishing pad employs different groove patterns in different radial zones: an inner region with a first groove pattern and an outer region with a second groove pattern. This local differentiation optimizes slurry distribution in each zone, counteracting the squeegee effect from carrier rings while maintaining overall system simplicity.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The polishing pad surface is segmented into multiple radial zones with distinct groove configurations. The grooves are divided into different patterns (e.g., radial grooves in inner region, circumferential grooves in outer region) to address slurry distribution issues at different locations, reducing overall slurry consumption through targeted local optimization.

Inventive Principle:

Principle #1Segmentation

2Loss of substance

If uniform groove width and depth are used, then manufacturing is simpler, but slurry flow distribution across the polishing surface is insufficient

Engineering Contradiction:

Improveslurry utilizationVSAvoidgroove fabrication complexity

Core Design Contradiction:

Loss of substanceVSEase of manufacture

Solution Approach 1:

The groove dimensions vary by location: inner region grooves have different width and depth characteristics compared to outer region grooves. This local variation in groove geometry optimizes slurry flow distribution across different radial zones, improving slurry utilization while using standard manufacturing processes.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS7520798B2Polishing pad with grooves to reduce slurry consumption

Publication Date: 2009.04.21 DUPONT ELECTRONIC MATERIALS HLDG INC

AI summary

A chemical mechanical polishing pad having an annular polishing track and a concentric center O. The polishing pad includes a polishing layer having a plurality of pad grooves formed therein. The polishing pad is designed for use with a carrier, e.g., a wafer carrier, that includes a polishing ring having a plurality of carrier grooves. Each of the plurality of pad grooves has a carrier-compatible groove shape configured to enhance the transport of a polishing medium beneath the carrier ring on the leading edge of the carrier ring during polishing.