CMP Substrate Pre-cleaning via Merged Cleaning Module
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Solution Overview
Problem
The existing substrate processing systems face challenges in efficiently removing foreign substances before the polishing process, leading to reduced polishing efficiency, increased costs, and potential damage to substrates during chemical mechanical polishing, while also complicating the layout and increasing the cost of equipment.
Innovation Solution
A substrate processing system that includes a polishing part for Chemical Mechanical Polishing (CMP) and a cleaning part for pre-cleaning substrates before polishing, allowing for the removal of foreign substances without modifying existing equipment or reducing process efficiency, using methods like cleaning liquid spraying, steam spraying, and heterogeneity fluid spraying to prepare substrates before they enter the polishing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate preliminary cleaning space is added to perform preliminary cleaning before the cleaning module, then cleaning efficiency is improved, but device complexity and layout complexity increase
Solution Approach 1:
The patent combines the preliminary cleaning function with the existing cleaning module by configuring the cleaning module to perform both preliminary cleaning of substrates before polishing and final cleaning after polishing. This integration eliminates the need for a separate preliminary cleaning space while maintaining improved cleaning efficiency, thus resolving the contradiction between cleaning efficiency and layout complexity.
Solution Approach 2:
The cleaning module is designed to serve multiple functions: it can clean substrates before they enter the polishing process (preliminary cleaning) and clean substrates after polishing (final cleaning). This multi-functionality allows the system to achieve better cleaning efficiency without adding separate cleaning equipment, thereby avoiding increased layout complexity.
2Reliability
If a separate preliminary cleaning space is added, then foreign substance removal is improved, but the treatment process becomes complicated and transfer time increases
Solution Approach 1:
The patent merges the preliminary cleaning operation into the existing cleaning module, allowing substrates to be cleaned in place without requiring transfer to a separate preliminary cleaning space. This eliminates additional transfer steps and reduces the overall treatment time while maintaining effective foreign substance removal capability.
Solution Approach 2:
The cleaning module is configured to perform preliminary cleaning of substrates before they enter the polishing process. By preparing substrates in advance within the same module, the system removes foreign substances effectively without requiring subsequent transfers to separate cleaning spaces, thus reducing total processing time.
3Reliability
If preliminary cleaning is performed in a separate space, then cleaning efficiency is improved, but productivity decreases due to complicated transfer processes
Solution Approach 1:
The patent integrates the preliminary cleaning function within the existing cleaning module, eliminating the need for substrates to be transferred to and from a separate preliminary cleaning space. This integration maintains the benefits of preliminary cleaning while avoiding the productivity loss associated with complicated transfer processes, thus resolving the contradiction between cleaning efficiency and productivity.
4Productivity
If foreign substances remain on the substrate during polishing, then polishing can be performed, but substrate damage and polishing accuracy decrease
Solution Approach 1:
The cleaning module performs preliminary cleaning of substrates before they enter the polishing process, removing foreign substances in advance. This preliminary action prevents substrate damage and maintains polishing accuracy while allowing the polishing process to proceed continuously, thus resolving the contradiction between process continuity and manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances polishing efficiency, reduces substrate damage, and improves cleaning efficiency without additional equipment changes, maintaining process efficiency and minimizing foreign substances on the substrate before polishing, thereby preventing scratches and optimizing the cleaning process.
Implementation Method 1
cleaning liquid spraying
Implementation Method 2
steam spraying
Implementation Method 3
heterogeneity fluid spraying
Data Source
AI summary
Provided is a substrate processing system and a substrate processing method. The substrate processing system includes a polishing part for performing a Chemical Mechanical Polishing (CMP) process on a substrate, a cleaning part for cleaning the substrate on which the polishing process is performed, and a substrate transferring part for transferring the substrate to the cleaning part before polishing the substrate in the polishing part. The substrate may be preparatorily cleaned in the cleaning part before the polishing process, and then enters the polishing part.