CMP Pre-polishing Pad for Liquid Distribution and Scratch Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Chemical mechanical polishing (CMP) processes face issues with uneven distribution and wastage of grinding liquid, leading to increased costs and wafer scratches due to poor liquid distribution and high-speed rotation-induced liquid removal, as well as the need for frequent cleaning of diamond discs.
Innovation Solution
A chemical mechanical polishing device and method that includes a cleaning apparatus with a pre-polishing pad and pre-polishing grinding liquid dispensing assembly to improve liquid distribution and reduce waste, along with a polishing pad conditioner disc that performs pre-polishing, polishing, and cleaning operations to minimize scratches and optimize liquid usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high-speed rotation is used for polishing, then polishing efficiency is improved, but grinding liquid is removed from the polishing pad resulting in waste
Solution Approach 1:
The invention applies preliminary action by introducing a pre-polishing pad that pre-distributes grinding liquid onto the polishing pad before the main polishing operation. This ensures the polishing pad is adequately saturated with grinding liquid beforehand, preventing liquid removal and waste during high-speed rotation polishing.
2Manufacturing precision
If grinding liquid flow rate is increased to improve distribution, then liquid distribution evenness is improved, but grinding liquid consumption increases
Solution Approach 1:
The invention segments the grinding liquid distribution process into two stages: pre-distribution by the pre-polishing pad before polishing, and main distribution during polishing. This segmentation allows optimized liquid usage by ensuring even distribution beforehand, reducing the need for excessive liquid flow during the main polishing operation.
Solution Approach 2:
The pre-polishing pad performs preliminary grinding liquid distribution onto the polishing pad before the main polishing operation begins. This preliminary action ensures uniform liquid coverage, improving distribution evenness while reducing overall liquid consumption during the actual polishing process.
3Manufacturing precision
If diamond disc cleaning is performed frequently to maintain polishing quality, then wafer scratch reduction is improved, but process time and complexity increase
Solution Approach 1:
The invention merges the diamond disc cleaning function with the pre-polishing pad operation. The pre-polishing pad simultaneously performs its primary function of grinding liquid distribution and also cleans the diamond disc surface, eliminating the need for separate cleaning operations and reducing process complexity.
Solution Approach 2:
The pre-polishing pad serves multiple functions: it distributes grinding liquid onto the polishing pad, pre-polishes the diamond disc surface, and cleans the diamond disc. This multi-functionality reduces the need for separate cleaning operations, simplifying the overall process while maintaining wafer quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces wafer scratches and improves the evenness of grinding liquid distribution during polishing, while also saving consumption of polishing grinding liquid by optimizing the pre-polishing and cleaning operations within the CMP process.
Implementation Method 1
a rotation driver configured to drive the pre-polishing pad to rotate during the pre-polishing operation
Implementation Method 2
a pre-polishing grinding liquid dispensing assembly, disposed on a side edge of the cleaning disc and configured to supply a pre-polishing grinding liquid to the pre-polishing pad
Implementation Method 3
a pre-polishing pad, disposed inside the cleaning disc and configured to perform a pre-polishing operation of the polishing pad conditioner disc
Implementation Method 4
the cleaning apparatus includes: a cleaning disc; a pre-polishing pad, disposed inside the cleaning disc and configured to perform a pre-polishing operation of the polishing pad conditioner disc
Data Source
AI summary
The present disclosure describes a chemical mechanical polishing device and a chemical mechanical polishing method. The chemical mechanical polishing device includes: a cleaning apparatus and a polishing pad conditioner disc positionally configurable relative to the cleaning apparatus, where the cleaning apparatus includes: a cleaning disc; a pre-polishing pad disposed inside the cleaning disc and configured to perform a pre-polishing operation of the polishing pad conditioner disc when positioned in contact with the polishing pad conditioner disc; a pre-polishing grinding liquid dispensing assembly disposed on a side edge of the cleaning disc and configured to supply a pre-polishing grinding liquid to the pre-polishing pad; and a rotation driver configured to drive the pre-polishing pad to rotate during the pre-polishing operation. The present disclosure beneficially reduces wafer scratches and increases evenness of distribution of a grinding liquid during polishing.