CMP Retaining Ring with Integrated Acoustic Sensor
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Solution Overview
Problem
Current chemical mechanical polishing (CMP) processes lack integrated sensors for real-time monitoring and feedback, making it difficult to accurately detect endpoint conditions and catastrophic events such as substrate breakage or slip during the polishing process.
Innovation Solution
A retaining ring with an integrated acoustic/vibration sensor is used to capture and analyze emissions from the CMP process, enabling real-time monitoring and feedback for process control, endpoint detection, and fault diagnosis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional CMP retaining rings are used without integrated sensors, then the device structure remains simple and cost-effective, but the ability to detect endpoint conditions and catastrophic events in real-time is lost
Solution Approach 1:
The patent merges the retaining ring structure with an acoustic sensor into a single integrated component. The sensor is embedded within the retaining ring, allowing simultaneous functions of mechanical retention and acoustic emission detection without requiring separate sensor mounting hardware or additional structural elements.
Solution Approach 2:
The retaining ring is designed to serve multiple functions: it provides mechanical retention for the substrate, maintains positioning during CMP processing, and simultaneously acts as a mounting structure for the acoustic sensor that detects endpoint conditions and catastrophic events. This multi-functionality eliminates the need for separate components.
2Measurement precision
If no real-time monitoring is implemented during CMP, then the process control system remains simple, but endpoint detection accuracy and response time to catastrophic events deteriorate
Solution Approach 1:
The integrated acoustic sensor provides real-time feedback during the CMP process by detecting acoustic emissions that indicate endpoint conditions or catastrophic events such as substrate breakage or slippage. This feedback enables immediate process adjustment or shutdown to prevent defects.
Solution Approach 2:
The patent replaces complex mechanical endpoint detection methods with acoustic emission sensing. Instead of using mechanical probes or contact-based measurement systems, the acoustic sensor detects vibrations and sounds generated during polishing, providing non-contact, real-time measurement with high precision.
3Reliability
If integrated sensors are added to the retaining ring, then real-time detection capability is improved, but the manufacturing complexity and cost of the retaining ring increase
Solution Approach 1:
The retaining ring is designed as a segmented or modular structure that allows the acoustic sensor to be integrated into a specific section. This segmentation enables manufacturers to produce the retaining ring body using traditional methods and then incorporate the sensor module, simplifying the overall manufacturing process compared to creating a completely new sensor-integrated component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for proactive equipment health monitoring, reducing unscheduled downtime, improving tool availability, and minimizing scrap by providing continuous feedback on equipment performance and detecting abnormalities in real-time.
Implementation Method 1
a sensor disposed within the channel and proximate the first end, wherein the sensor is configured to detect acoustic and/or vibration emissions from processes performed on the substrate
Data Source
AI summary
A retaining ring for a chemical mechanical polishing carrier head having a mounting surface for a substrate is provided herein. In some embodiments, the retaining ring may include an annular body have a central opening, a channel formed in the body, wherein a first end of the channel is proximate the central opening, and a sensor disposed within the channel and proximate the first end, wherein the sensor is configured to detect acoustic and/or vibration emissions from processes performed on the substrate.