CMP Polishing Head Slipout Detection Using Arm Torque
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Solution Overview
Problem
Existing substrate polishing techniques, such as those described in PTLs 1 and 2, face inaccuracies in detecting substrate slipout due to noise interference from vibrations during the polishing process, which affects the rotation drive current and fluid pressure/flow rate measurements.
Innovation Solution
A substrate processing apparatus with a polishing head, retainer member, retainer member pressurization chamber, and arm, where the slipout is detected based on the turning torque of the arm or the flow rate of fluid supplied to the retainer member pressurization chamber, reducing noise interference and improving detection accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If substrate slipout detection is performed using rotation drive current of polishing head or polishing table, then slipout detection is achieved, but detection accuracy deteriorates due to vibration noise during polishing
Solution Approach 1:
The invention extracts the detection target from the polishing system by selecting the arm's turning torque as the measurement parameter instead of the polishing head or table's rotation drive current. The arm's torque reflects substrate slipout conditions without being directly affected by polishing vibrations, thereby separating the detection function from the harmful vibration source.
Solution Approach 2:
The invention introduces an intermediary measurement point - the arm that connects the polishing head to the polishing table. By measuring the turning torque of this intermediary component rather than the direct polishing components, the system obtains slipout detection data that is indirectly coupled to the polishing process, reducing direct vibration interference.
2Measurement precision
If substrate slipout detection is performed using pressure or flow rate of fluid supplied to back surface of substrate, then slipout detection is achieved, but detection accuracy deteriorates due to vibration noise during polishing
Solution Approach 1:
The invention extracts the detection measurement from the substrate-fluid interface by measuring the arm's turning torque instead of the fluid pressure or flow rate at the substrate back surface. This removes the detection point from the region directly affected by polishing vibrations.
Solution Approach 2:
The invention uses the arm's turning torque as an intermediary parameter that reflects substrate slipout conditions without requiring direct measurement at the vibration-prone fluid-substrate interface. The arm torque serves as a remote sensing indicator of slipout events.
3Productivity
If polishing head and polishing table directly press substrate during polishing, then effective polishing is achieved, but vibration is generated that interferes with detection measurements
Solution Approach 1:
The invention extracts the detection function from the polishing contact zone by measuring the arm's turning torque rather than parameters from the polishing head or table. This separates the detection measurement from the vibration-generating polishing interface while maintaining effective polishing pressure.
Solution Approach 2:
The invention introduces the arm's turning torque as an intermediary measurement that captures slipout information without being generated by the direct polishing contact. The arm serves as a mechanical intermediary that transmits slipout effects to the measurement point without introducing vibration noise.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the accuracy of substrate slipout detection by isolating the detection mechanism from vibration-induced noise, thereby reducing erroneous readings and improving the reliability of the detection process.
Implementation Method 1
The slip out detector is for detecting a slipout of the substrate from the polishing head based on a turning torque of the arm
Implementation Method 2
The slip out detector is for detecting a slipout of the substrate from the polishing head based on a flow rate of a fluid supplied to the retainer member pressurization chamber
Data Source
AI summary
Accuracy of detection of a fly out of a substrate from a polishing head is improved. A substrate processing apparatus includes a polishing table 350 to which a polishing pad 352 for polishing the substrate is attachable, a polishing head 302 for holding and pressing the substrate against the polishing pad 352, a retainer member disposed surrounding the polishing head 302, a retainer member pressurization chamber disposed adjacent to the retainer member, an arm 360 for holding and turning the polishing head 302, and a slip out detector 910 for detecting a fly out of the substrate from the polishing head 302 based on a turning torque of the arm 360 or based on a flow rate of a fluid supplied to the retainer member pressurization chamber.