CMP Sludge Recycling Process for Silicon Dioxide Recovery
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Solution Overview
Problem
Semiconductor chemical mechanical polishing (CMP) sludge is treated as general industrial waste, leading to resource wastage and lack of environmental benefits, as current disposal methods do not allow for resource reuse.
Innovation Solution
A recycling device comprising a roasting, soaking and stirring, first and second centrifugal dehydration, and cleaning devices, utilizing inorganic and organic acids to process CMP sludge, converting it into silicon dioxide goods for reuse as refractory and ceramic materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If CMP sludge is treated as general industrial waste and disposed of through burial or incineration, then the waste can be removed from the factory, but resource reuse is lost and environmental benefits are minimized
Solution Approach 1:
The patent converts CMP sludge, which is currently treated as harmful waste requiring disposal, into valuable silicon dioxide powder through a multi-step processing system. The sludge undergoes roasting to remove organics, acid soaking to dissolve impurities, and centrifugal separation to purify the silicon dioxide, transforming it from waste into reusable material for refractory and ceramic applications
Solution Approach 2:
The patent employs systematic parameter changes throughout the processing sequence: temperature control during roasting (800-1200°C), acid concentration control during soaking (1-5N), and centrifugal force application during separation. These parameter optimizations enable efficient conversion of sludge into high-purity silicon dioxide powder
2Productivity
If CMP sludge is processed through multiple treatment steps to recover silicon dioxide, then resource reuse is achieved, but device complexity increases
Solution Approach 1:
The patent divides the sludge processing into distinct operational modules: a roasting device for thermal treatment, a soaking and stirring device for acid treatment, a first centrifugal dehydration device for initial separation, a cleaning device for washing, and a second centrifugal dehydration device for final dewatering. Each module performs a specific function, making the complex process manageable and scalable
Solution Approach 2:
The patent introduces acid solutions as an intermediary medium to facilitate the dissolution of impurities from the silicon dioxide matrix during the soaking stage. This intermediary enables selective removal of unwanted substances while leaving the desired silicon dioxide intact, simplifying the separation process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device recycles CMP sludge into silicon dioxide powder, enabling resource reuse and providing environmental benefits by converting it into valuable materials.
Implementation Method 1
the roasting device heat-treats the semiconductor chemical mechanical polishing sludge to remove the organic impurities
Implementation Method 2
the impregnating liquid is implemented as a single ingredient solution of inorganic acid or organic acid, or as a mixed solution composed of inorganic acid, organic acid and deionized water... so as to dissolve the impurities that allow the acid to dissolve
Implementation Method 3
the product obtained by impregnation and stirring of the soaking and stirring device is solidified and concentrated through the first centrifugal dehydration device so as to remove the impregnating liquid in the product obtained
Data Source
AI summary
The present invention relates to a semiconductor chemical mechanical polishing sludge recycling device, which includes a roasting device, a soaking and stirring device, a first centrifugal dehydration device, a cleaning device and a second centrifugal dehydration device arranged thereon. The roasting device heat-treats the semiconductor chemical mechanical polishing sludge to remove the impurities. The soaking and stirring device is connected with the roasting device. The roasted semiconductor chemical mechanical polishing sludge is placed in the soaking and stirring device. The first centrifugal dehydration device is connected with the soaking and stirring device. A product obtained by the soaking and stirring device is solidified and concentrated through the first centrifugal dehydration device. The cleaning device is connected with the first centrifugal dehydration device. The second centrifugal dehydration device is connected with the cleaning device. The product obtained through the centrifugation of the second centrifugal dehydration device is a silicon dioxide goods.

