CMP Slurry Arm With Oxygen Removal Chamber for Corrosion Prevention

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Solution Overview

Problem

Excessive oxygen in slurry used for chemical mechanical polishing (CMP) processes corrodes metal layers on semiconductor substrates, leading to potential damage during the polishing process.

Innovation Solution

A slurry arm equipped with an oxygen removal chamber, purge gas supplier, and pressure control mechanisms to float and discharge excess oxygen from the slurry, preventing its dissolution and subsequent corrosion of metal layers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If slurry is supplied through the slurry arm, then the polishing process can be performed, but excessive oxygen dissolves in the slurry causing corrosion of metal layers

Engineering Contradiction:

Improvepolishing process reliabilityVSAvoidoxygen-induced corrosion

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent extracts harmful dissolved oxygen from the slurry by introducing purge gas bubbles that float oxygen to the surface for removal through the main valve, preventing oxygen-induced corrosion of metal layers

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent uses purge gas as an intermediary substance that interacts with dissolved oxygen in the slurry, facilitating oxygen removal through bubble formation and flotation without directly contacting the slurry in a harmful manner

Inventive Principle:

Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If an oxygen removal chamber is added to remove oxygen from slurry, then corrosion is prevented, but device complexity increases

Engineering Contradiction:

Improveoxygen corrosionVSAvoidslurry arm structure

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent merges the oxygen removal chamber with the existing slurry arm structure, integrating multiple functions (slurry storage, oxygen removal, and discharge) into a single unified component rather than adding separate independent systems

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The slurry arm is designed with multi-functionality, serving both as a slurry delivery mechanism and an oxygen removal system through the integrated oxygen removal chamber and purge gas supplier

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Productivity

If purge gas is supplied to float oxygen, then oxygen removal efficiency improves, but gas management complexity increases

Engineering Contradiction:

Improveoxygen removal efficiencyVSAvoidgas discharge control

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent employs a main valve that automatically discharges gas from the oxygen removal chamber based on internal pressure conditions, enabling self-regulated gas management without requiring complex external control systems

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Prevents metal layer corrosion by ensuring only the oxidizing agent in the slurry reacts with the substrate, maintaining the integrity of the polishing process.

Implementation Method 1

The purge gas supplier may supply bubbles, which may be formed by the purge gas, to the slurry temporarily received in the oxygen removal chamber to float the oxygen in the slurry

Methodology Applied

Scientific EffectBubble formation and flotation: Bubble

Data Source

PatentUS12485515B2Slurry arm and chemical mechanical polishing apparatus including the same

Publication Date: 2025.12.02 SAMSUNG ELECTRONICS CO LTD

AI summary

A slurry arm is provided. The slurry arm includes: an arm body; a slurry line that extends through the arm body; an oxygen removal chamber provided in the arm body and configured to receive slurry from the slurry line; a purge gas supplier configured to supply a purge gas to the slurry in the oxygen removal chamber; and a main valve configured to selectively discharge gas from the oxygen removal chamber.