CMP Slurry With Coated TiO2 Abrasives for Scratch Reduction

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Solution Overview

Problem

Existing chemical mechanical polishing (CMP) processes face challenges in efficiently removing conductive and dielectric materials without causing surface scratches and in maintaining the stability and shelf life of CMP slurries.

Innovation Solution

The development of spherical titanium dioxide abrasive particles with protective organic layers and controlled pH CMP slurries, along with a CMP system incorporating localized light sources, enhances the efficiency and stability of the polishing process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional CMP slurries are used, then conductive and dielectric materials can be removed, but surface scratches are caused and slurry stability deteriorates

Engineering Contradiction:

Improvesurface scratch reductionVSAvoidsurface scratches

Core Design Contradiction:

Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The patent employs spherical abrasive particles instead of conventional irregularly shaped particles. The spherical geometry reduces surface scratches by providing uniform contact and rolling motion during polishing, eliminating the scratching caused by angular edges and irregular surfaces of traditional abrasives.

Inventive Principle:

Principle #14Spheroidality (Curvature)

Solution Approach 2:

The patent uses composite abrasive particles consisting of a core material (such as silicon dioxide or tungsten carbide) coated with a protective layer (such as silicon oxide or diamond-like carbon). This composite structure combines the hardness and cutting ability of the core with the surface protection and scratch-reduction properties of the coating layer.

Inventive Principle:

Principle #40Composite materials

2Reliability

If CMP slurry is stored for extended periods, then cost efficiency improves, but slurry stability and performance deteriorate

Engineering Contradiction:

Improveslurry stabilityVSAvoidslurry shelf life

Core Design Contradiction:

ReliabilityVSDuration of action of stationary object

Solution Approach 1:

The patent modifies the chemical parameters of the slurry by adjusting pH levels, adding chelating agents, and controlling oxidizer concentrations. These parameter changes create a stable chemical environment that prevents particle aggregation, oxidation, and degradation, enabling extended shelf life while maintaining polishing performance.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent introduces stabilizing agents and chelating compounds as intermediaries that mediate between the abrasive particles and the slurry environment. These intermediaries prevent direct harmful interactions, such as oxidation of metal particles or aggregation of abrasive grains, thereby preserving slurry stability during storage.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Productivity

If polishing pressure is increased to improve removal rate, then productivity increases, but surface damage and scratches worsen

Engineering Contradiction:

Improvematerial removal rateVSAvoidsurface damage

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The spherical abrasive particles enable higher polishing pressures to be applied without causing surface damage. The rounded geometry distributes contact forces uniformly and allows rolling motion that cuts material efficiently while minimizing scratching, unlike angular particles that concentrate stress at sharp edges.

Inventive Principle:

Principle #14Spheroidality (Curvature)

Solution Approach 2:

The patent optimizes the hardness and elasticity parameters of both the abrasive particles and the polishing pad to enable higher removal rates at controlled pressures. By adjusting these material parameters, the system achieves high productivity while maintaining surface integrity through reduced stress concentration.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution reduces surface scratches and prolongs slurry shelf life, leading to cost-effective and efficient removal of conductive and dielectric materials with higher removal rates and improved planarity.

Implementation Method 1

spherical titanium dioxide abrasive particles with protective organic layers

Methodology Applied

Scientific EffectSurface coating protection: Coatings

Implementation Method 2

chemical mechanical polishing (CMP) processes face challenges in efficiently removing conductive and dielectric materials

Methodology Applied

Scientific EffectChemical mechanical polishing: Abrasion

Implementation Method 3

CMP system incorporating localized light sources

Methodology Applied

Scientific EffectPhotochemical reaction: Photo-oxidation

Data Source

PatentUS20250339931A1Methods of Forming an Abrasive Slurry and Methods for Chemical-Mechanical Polishing

Publication Date: 2025.11.06 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A method of performing a polishing process is provided. The method may include forming spherical titanium dioxide nano-particles, covering the spherical titanium dioxide nano-particles with an organic coating, storing the spherical titanium dioxide nano-particles together with an oxidizer, forming a polishing solution with the spherical titanium dioxide nano-particles, applying the polishing solution on a surface of a work piece, and polishing the surface of the work piece with the polishing solution.