CMP Slurry Composition for Fast SiC Polishing With Lower Pad Heat
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Solution Overview
Problem
Existing polishing compositions face challenges in achieving a high polishing removal rate while minimizing the increase in temperature of the polishing pad, particularly when dealing with high hardness materials like silicon carbide, and there is a need for improved stability during storage.
Innovation Solution
A polishing composition containing abrasive particles, permanganate, and an aluminum salt, with specific concentration and content ratios that balance polishing removal rate and pad temperature increase, as defined by the formulae (1) and (2): 500 ≤ C1/W1 ≤ 0.04 ≤ C2/C1, where C1 is the permanganate concentration, C2 is the aluminum salt concentration, and W1 is the abrasive content.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional polishing compositions with small abrasive particles (less than 150 nm) are used, then polishing speed is improved, but non-uniform polishing and surface defects increase
Solution Approach 1:
The patent changes the particle size parameter of the abrasive from conventional small particles (less than 150 nm) to a specific range (150 nm to 5 µm) to achieve both high polishing speed and uniform surface finish. This parameter optimization resolves the contradiction between productivity and manufacturing precision.
2Productivity
If polishing compositions with high abrasive concentration are used, then polishing speed increases, but composition stability and control become difficult
Solution Approach 1:
The patent optimizes the concentration parameter of the abrasive within a specific range (0.1 wt% to 10 wt%) to achieve effective polishing speed while maintaining composition stability. This controlled parameter range prevents both insufficient polishing and composition instability.
3Productivity
If conventional polishing compositions are used, then polishing capability is achieved, but environmental pollution and health hazards increase due to bacterial growth
Solution Approach 1:
The patent converts the harmful effect of water (which promotes bacterial growth) into a benefit by using it as the base medium for an environmentally friendly polishing composition. The composition uses water instead of harmful solvents, and includes preservatives to prevent bacterial growth, thereby eliminating pollution while maintaining polishing capability.
Solution Approach 2:
The patent creates an inert environment by using water as the base medium and adding preservatives to prevent bacterial growth, thereby eliminating the harmful effects of organic solvents and bacterial contamination while maintaining effective polishing performance.
4Productivity
If mechanical polishing methods are used, then polishing capability is achieved, but generation of polishing waste and energy consumption increase
Solution Approach 1:
The patent replaces purely mechanical polishing with a chemical-mechanical polishing process using a specially formulated slurry composition. The chemical components (surfactants, preservatives, and other additives) work synergistically with the mechanical action to reduce the required mechanical energy input while improving polishing efficiency and reducing waste generation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively improves polishing removal rate and reduces pad temperature increase, enhancing productivity and preservation stability, especially for high hardness materials such as silicon carbide.
Implementation Method 1
a polishing composition containing an abrasive
Implementation Method 2
a concentration C1 [mM] of the permanganate, and a concentration C2 [mM] of the aluminum salt satisfies both of the following formulae (3) and (4): 200≤C1/√W1 and 8≤C2
Data Source
AI summary
Provided is a polishing composition containing an abrasive, permanganate, an aluminum salt, and water. The abrasive has an average primary particle diameter of 150 nm or more and 5 µm or less. In the polishing composition, a relation of a content W1 [% by weight] of the abrasive, a concentration C1 [mM] of the permanganate, and a concentration C2 [mM] of the aluminum salt satisfies both of the following formulae (3) and (4): 200≤C1/√W1 and 8≤C2