CMP Supporting Member Dynamic Adjustment
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Solution Overview
Problem
The existing CMP apparatuses do not effectively adjust the supporting member in accordance with the state of the substrate's surface during polishing, leading to issues with polishing uniformity.
Innovation Solution
A substrate processing apparatus with a driving mechanism that adjusts the height and distance of the supporting member in real-time based on the substrate's film thickness profile, ensuring the supporting member can support the polishing pad overhanging outside the substrate, and includes a film thickness measuring instrument to monitor and adjust the polishing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the supporting member is fixed in position, then the device structure is simple, but the polishing uniformity deteriorates because the supporting member cannot adapt to the substrate's surface state during polishing
Solution Approach 1:
The supporting member is transformed from a fixed static structure to a dynamic adjustable structure. The driving mechanism enables the supporting member to move in the radial direction and adjust its height, allowing it to adapt to different substrate surface states during polishing, thereby improving polishing uniformity while managing device complexity through controlled mobility.
Solution Approach 2:
The position parameters of the supporting member (radial distance and height) are made variable through the driving mechanism. By changing these parameters dynamically during the polishing process based on substrate surface conditions, the system achieves better polishing uniformity without requiring complete structural redesign.
2Manufacturing precision
If the supporting member is adjusted frequently to match substrate surface state, then polishing uniformity improves, but the operation complexity increases
Solution Approach 1:
The supporting member adjustment system incorporates feedback from substrate surface state measurements, enabling the driving mechanism to automatically adjust the supporting member position without requiring manual intervention. This self-adjusting capability maintains high polishing uniformity while significantly reducing operational complexity.
Solution Approach 2:
The system uses feedback from substrate surface state monitoring to control the driving mechanism's adjustment of the supporting member. This closed-loop control ensures the supporting member is positioned optimally for each polishing condition, achieving consistent polishing quality while simplifying operator tasks through automated decision-making.
3Ease of operation
If the supporting member is positioned far from the substrate, then it does not interfere with substrate loading, but it cannot provide adequate support for the polishing pad during polishing
Solution Approach 1:
The supporting member's radial position is made dynamically adjustable through the driving mechanism. During substrate loading, the supporting member is positioned far from the substrate to avoid interference. During polishing, it moves closer to provide adequate support for the polishing pad, thus resolving the contradiction between loading ease and polishing support through temporal separation of functions.
Data Source
AI summary
Polishing uniformity of a surface to be polished of a substrate is improved by appropriately according with a state of the surface to be polished during polishing. A substrate processing apparatus includes a table 100 for supporting a substrate WF, a pad holder 226 for holding a polishing pad 222 for polishing the substrate WF supported by the table 100, an elevating mechanism for elevating the pad holder 226 with respect to the substrate WF, a swing mechanism for swinging the pad holder 226 in a radial direction of the substrate WF, supporting members 300A and 300B for supporting the polishing pad 222 swung to outside the table 100 by the swing mechanism, and driving mechanisms 310 and 320 for adjusting at least one of a height and a distance to the substrate WF of the supporting member 300 while polishing the substrate WF.