CMP Brush Cleaning Module With Three-Roller Sequential Scrubbing
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Solution Overview
Problem
Existing CMP systems require multiple cleaning stations for substrate cleaning, increasing processing time and manufacturing costs due to the use of scrubbing brushes.
Innovation Solution
A brush cleaning system with a three-cylindrical roller configuration that allows for multiple cleanings in a single station, where each side of the substrate is cleaned sequentially by different rollers, enhancing throughput and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple cleaning stations are used to perform multiple cleanings of the substrate, then cleaning effectiveness is improved, but processing time increases and manufacturing costs increase
Solution Approach 1:
The patent combines multiple cleaning functions into a single cleaning station by using multiple brushes (first brush for front surface, second brush for back surface) that can simultaneously or sequentially clean both surfaces of the substrate within one station, eliminating the need for separate cleaning stations and reducing processing time
Solution Approach 2:
The cleaning station is designed with multi-functional capability to perform both front surface cleaning and back surface cleaning operations within the same station, allowing a single station to replace what would traditionally require multiple specialized cleaning stations
2Reliability
If multiple cleaning stations are used to perform multiple cleanings of the substrate, then cleaning effectiveness is improved, but manufacturing costs increase
Solution Approach 1:
The patent combines multiple cleaning functions into a single cleaning station by using multiple brushes (first brush for front surface, second brush for back surface) that can simultaneously or sequentially clean both surfaces of the substrate within one station, eliminating the need for separate cleaning stations and reducing processing time
Solution Approach 2:
The cleaning station is designed with multi-functional capability to perform both front surface cleaning and back surface cleaning operations within the same station, allowing a single station to replace what would traditionally require multiple specialized cleaning stations
3Device complexity
If traditional single brush cleaning is used, then device complexity is reduced, but productivity decreases
Solution Approach 1:
The cleaning system is segmented into multiple functional components (first brush, second brush, first support, second support) that can be independently controlled and positioned, allowing simultaneous or sequential cleaning of different substrate surfaces to increase throughput without creating an overly complex integrated system
Solution Approach 2:
The patent adds a dimensional aspect to the cleaning process by introducing brushes that can clean both the front and back surfaces of the substrate, effectively utilizing the third dimension (substrate thickness/depth) to perform additional cleaning operations within the same processing space and time frame
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system efficiently cleans both sides of the substrate using a single cleaning station, thereby increasing throughput and reducing manufacturing costs by minimizing the need for additional cleaning stations.
Implementation Method 1
The brushes are spaced apart when the substrate is received or removed from the scrubbing assembly. The brushes are brought into contact with the substrate during cleaning.
Implementation Method 2
the physical cleaning methods largely consist of physically removing excess metals using scrubbing brushes
Data Source
AI summary
A brush cleaning system for cleaning a substrate includes a tank, and a first cylindrical roller, a second cylindrical roller, and a third cylindrical roller disposed in the tank. The brush cleaning system also includes a first cleaning position defined between the first cylindrical roller and the second cylindrical roller, and a second cleaning position defined between the second cylindrical roller and the third cylindrical roller. When the substrate is disposed in the first cleaning position, the first cylindrical roller is configured to clean a first side of the substrate and the second cylindrical roller is configured to clean a second side of the substrate. When the substrate is disposed in the second cleaning position, the second cylindrical roller is configured to clean the second side of the substrate and the third cylindrical roller is configured to clean a first side of the substrate.


