CMP Apparatus with Transmissive Pad and Rotatable Light Irradiation
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Solution Overview
Problem
Current chemical mechanical polishing (CMP) technologies face challenges in process control as semiconductor product technology development becomes more complex, requiring additional control measures to enhance polishing speed and dispersion control.
Innovation Solution
A CMP apparatus incorporating a polishing platen with a transmissive polishing pad and a light irradiation part that uses photocatalysts in the slurry, where the light irradiation part is rotatable and adjustable to control light distribution, enhancing the chemical mechanical polishing process by accelerating reactions and improving dispersion control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If additional process control measuring instruments are introduced to respond to increasing process difficulty, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The patent replaces traditional mechanical process control instruments with a light-based optical measurement system. The light irradiation part and light detection part enable non-contact measurement of polishing parameters, eliminating the need for complex mechanical sensing devices while achieving precise process control through optical fields.
Solution Approach 2:
The patent changes the measurement parameter from mechanical physical quantities to optical properties. By measuring light reflection, transmission, or absorption characteristics during polishing, the system achieves process control without adding mechanical complexity, utilizing optical parameter changes to monitor polishing status.
2Productivity
If light irradiation with photocatalysts is applied to accelerate polishing reactions, then productivity is improved, but use of energy increases
Solution Approach 1:
The patent utilizes photo-induced phase transitions in photocatalytic materials. Light irradiation triggers chemical reactions in the photocatalyst that accelerate material removal, enabling enhanced polishing speed through optical energy conversion to chemical energy rather than direct thermal heating.
Solution Approach 2:
The photocatalyst acts as an intermediary substance that converts optical energy to chemical energy. This mediator enables energy-efficient polishing by facilitating accelerated material removal reactions through light-induced chemical mechanisms rather than direct high-energy physical bombardment.
3Manufacturing precision
If light amount is controlled for different regions to improve dispersion control, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The light irradiation part is divided into multiple independently controllable regions or zones. Each region can be adjusted to provide different light intensities or wavelengths, enabling precise control of photocatalytic reactions in different areas of the polishing pad to achieve superior dispersion control.
Solution Approach 2:
The patent applies different light irradiation conditions to different local regions of the polishing pad. By varying light amount, wavelength, or intensity in specific zones, the system achieves localized optimization of photocatalytic activity to control material removal and dispersion precisely in each area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves polishing speed and reaction efficiency through targeted light reactions with photocatalysts, enabling better control over the CMP process and addressing the increasing complexity in semiconductor technology development.
Implementation Method 1
a slurry supply supplying a slurry including a photocatalyst to the polishing pad; a light irradiation part positioned within the opening of the polishing platen
Data Source
AI summary
This disclosure relates to a chemical mechanical polishing apparatus, and may include: a polishing platen including an opening; a polishing pad positioned on the polishing platen and including a transmissive part overlapping the opening; a slurry supply supplying a slurry including a photocatalyst to the polishing pad; a head part positioned on the polishing pad and capable of mounting a wafer; and a light irradiation part positioned within the opening of the polishing platen.