CMP Wafer Notch Detection Through an Optical Fluid Channel
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Solution Overview
Problem
Existing chemical mechanical polishing (CMP) systems face challenges in accurately monitoring substrate orientation and preventing slippage during post-CMP cleaning, as substrates can slip relative to the roller due to various factors influencing their orientation.
Innovation Solution
A detection assembly is integrated into the CMP system, utilizing a sensor to direct an optical signal through a fluid channel towards the substrate, allowing the controller to determine substrate presence, orientation, and detect slippage or drain clogging by analyzing changes in optical signal intensity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a groove is provided in the roller for receiving the substrate, then the substrate can be supported during cleaning, but the substrate may slip relative to the roller due to orientation influences
Solution Approach 1:
The patent replaces mechanical orientation monitoring methods with an optical detection system. A sensor detects the orientation of the substrate by receiving light signals that pass through or reflect off the substrate, enabling precise measurement of substrate orientation without relying solely on mechanical groove-roller-substrate interfaces. This optical detection system resolves the contradiction by providing accurate orientation monitoring independent of mechanical positioning stability.
2Adaptability or versatility
If multiple factors influence substrate orientation, then the substrate can be processed, but accurate monitoring of substrate orientation becomes difficult
Solution Approach 1:
The patent introduces an optical intermediary (light signal) to detect substrate orientation. The sensor receives light that interacts with the substrate, and the controller analyzes the light signal to determine orientation. This intermediary optical system allows accurate detection of substrate orientation even when multiple factors influence it, as the optical signal provides direct information about the substrate's actual orientation state rather than relying on mechanical assumptions.
3Productivity
If the brush contacts the substrate directly for cleaning, then particles can be removed, but substrate slippage cannot be detected
Solution Approach 1:
The patent makes the detection assembly multi-functional by using the same optical system to both monitor substrate orientation during cleaning and detect slippage between the substrate and roller. The sensor continuously receives optical signals from the substrate, and the controller analyzes these signals to determine both orientation and slippage conditions. This universal detection system enables simultaneous cleaning operation and monitoring without interfering with the cleaning process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively monitors substrate orientation and prevents slippage, ensuring reliable cleaning by detecting substrate presence and drain clogging, thereby enhancing the efficiency and accuracy of the cleaning process.
Implementation Method 1
The sensor is configured to direct an optical signal along the major axis of the channel and out of the outlet toward the substrate positioned in contact with the first support roller
Data Source
AI summary
The present disclosure describes an apparatus for substrate cleaning according to one or more embodiments. The apparatus includes a first support roller configured to support and rotate a substrate in contact with the first support roller, and a detection assembly. The detection assembly includes a body, a channel disposed through the body with a major axis aligned with an outlet of the channel, a sensor disposed in the body, and an inlet in fluid communication with the outlet. The outlet is configured to direct a fluid toward a surface of the substrate positioned in contact with the first support roller. The sensor is configured to direct an optical signal along the major axis of the channel and out of the outlet toward the substrate positioned in contact with the first support roller.