CMT Socket Retention Mechanisms for Blind Alignment and Shipping Loads
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Solution Overview
Problem
Current socket architectures, particularly compression mounted technology (CMT) socket architectures, face challenges during assembly and shipping due to blind alignment processes, leading to potential damage and defects, and require symmetric loading to prevent damage during shipping.
Innovation Solution
Incorporating visible coarse alignment features followed by precise blind alignment, and providing mechanisms to secure the socket to the board without preloading the CMT interconnect pins, allowing the pins to float or be compressed symmetrically during shipping to prevent damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a blind assembly process is used for pin alignment, then the assembly process can be simplified, but the alignment precision deteriorates leading to bent contacts and electrical failure
Solution Approach 1:
The patent applies preliminary action by providing visible alignment features (alignment pins or keys) that enable coarse alignment to be performed before the final blind press-fit assembly. This preliminary visible alignment ensures that the socket and substrate are properly positioned, preventing bent contacts during the subsequent blind assembly process while maintaining process simplicity.
2Strength
If the press fit is made tight to ensure secure connection, then the connection strength improves, but the risk of skiving and foreign material generation increases
Solution Approach 1:
The patent applies preliminary action by performing visible coarse alignment before the blind press-fit operation. This ensures that the socket and substrate are properly positioned, allowing the press-fit to be performed at the correct location with optimal force, thereby achieving secure connection without excessive force that would cause skiving or foreign material generation.
Solution Approach 2:
The patent replaces the traditional single-step blind mechanical press-fit with a two-stage process: first visible alignment (potentially using mechanical guides), then controlled blind press-fit. This substitution of the assembly mechanism reduces the risk of mechanical damage while maintaining connection strength.
3Ease of operation
If the press fit is made loose to ease assembly, then the ease of operation improves, but the risk of socket coming loose and contact damage increases
Solution Approach 1:
The patent applies preliminary action by performing visible coarse alignment before the blind press-fit. This ensures that the socket is properly positioned and will engage correctly with the substrate, allowing for easier assembly operation while maintaining reliable retention. The preliminary alignment prevents misalignment that would require rework or lead to loose connections.
4Reliability
If CMT socket architecture is used to achieve scalability and performance, then the HSIO performance improves, but the risk of fretting damage during shipping increases
Solution Approach 1:
The patent applies preliminary action by providing visible alignment features that enable proper positioning of the CMT socket before final assembly. This ensures that the interconnect pins are correctly aligned and secured, reducing the risk of movement and fretting damage during shipping while maintaining the performance benefits of CMT architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the risk of assembly defects and shipping damage by ensuring accurate alignment and symmetric loading of CMT interconnect pins, minimizing the risk of electrical failure and physical damage.
Implementation Method 1
a spring around the alignment standoff, wherein the spring applies a force to separate the substrate from the socket
Implementation Method 2
a retention cover over the socket, wherein the retention cover compresses a bottom end of the interconnect pins between the substrate and the retention cover
Data Source
AI summary
Embodiments disclosed herein include sockets and electronic packages with socket architectures. In an embodiment, a socket comprises a housing with a first surface and a second surface. In an embodiment, a plurality of interconnect pins pass through the housing. In an embodiment, an alignment hole is provided through the housing. In an embodiment, an alignment post extending out from the first surface of the housing is also provided.