CMUT Array Chip Integrating Non-Vibrating Capacitors
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Solution Overview
Problem
The existing ultrasonic transducer arrays using piezoelectric materials face challenges in miniaturization and sensitivity due to the need for amplifying circuits and capacitors, leading to enlarged probe sizes that complicate medical and industrial applications.
Innovation Solution
The integration of a non-vibrating capacitor and a resistance element within the same chip as the electrostatic capacitance ultrasonic transducer array, utilizing MEMS technology to form a compact ultrasonic transducer array that includes both vibrating and non-vibrating capacitors and resistance elements, allowing for miniaturization and improved performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If amplifying circuits and capacitors are mounted in the ultrasonic probe to ensure reception sensitivity, then reception sensitivity is improved, but the probe size becomes enlarged
Solution Approach 1:
The patent merges the amplifier and capacitor components directly into the CMUT chip structure. The amplifier is integrated as a circuit layer on the chip, and the capacitor is formed using the same electrode structures as the ultrasonic transducer elements. This integration eliminates the need for separate discrete components and reduces the overall probe size while maintaining reception sensitivity.
Solution Approach 2:
The patent transitions from a three-dimensional assembly of separate components to a two-dimensional planar integration on the chip. The amplifier circuit is laid out as planar conductive layers, and the capacitor is formed as planar electrode structures, utilizing the chip surface area efficiently to reduce the probe's overall volume.
2Reliability
If discrete capacitors and amplifying circuits are used in the ultrasonic probe, then reception sensitivity is maintained, but device complexity increases
Solution Approach 1:
The patent combines multiple functional components (amplifier, capacitor, and ultrasonic transducer elements) into a single integrated chip. The amplifier circuit is implemented as integrated circuitry sharing the chip substrate, and the capacitor uses the same electrode fabrication processes as the transducer elements, significantly reducing the total number of discrete components.
Solution Approach 2:
The patent designs the chip to serve multiple functions simultaneously. The same chip structure performs ultrasonic transmission, reception amplification, and capacitance functions. The electrode structures serve dual purposes as both the ultrasonic vibrator and the capacitor plates, reducing component count and simplifying the overall device architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the miniaturization of ultrasonic transducer arrays and probes, enhancing their performance by reducing the physical size and maintaining sensitivity, thus facilitating easier handling and improved diagnostic capabilities in medical and industrial applications.
Implementation Method 1
an electrostatic capacitance ultrasonic transducer (CMUT: Capacitive Micro-machined Ultrasonic Transducer) using the MEMS technology... DC and AC voltages are superimposed and applied to each electrode to vibrate a membrane (flexible film) near the resonance frequency, thereby generating ultrasonic waves
Implementation Method 2
vibrate a membrane (flexible film) near the resonance frequency, thereby generating ultrasonic waves
Implementation Method 3
a first capacitor which is a vibrator (referred to as a CMUT cell or simply a cell) of a CMUT and a second capacitor which is electrically connected to the first capacitor and is not vibrated acoustically are mounted together in the same chip
Data Source
AI summary
Capacitors, each of which is electrically connected to a capacitor which is the cell of the CMUT mounted in a chip and is used as a DC block capacitor for protecting an amplifying circuit, are formed as many as plural aligned channels in the chip. The capacitor is an electrostatic capacitance element which is not vibrated acoustically.