CMUT Chip Array Bonding for Large Sensing Area
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Solution Overview
Problem
The challenge is to increase the sensing area of semiconductor sensors while maintaining a high yield ratio, which is hindered by foreign matter and photolithography defects during the semiconductor manufacturing process, leading to reduced chip acquisition and economic efficiency.
Innovation Solution
The solution involves connecting multiple semiconductor sensor chips using bonding wires to form a larger sensing array, allowing for high-definition sensing over a larger area, as seen in the ultrasound diagnostic apparatus with CMUT chips arranged in a grid pattern.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the area of a single semiconductor sensor chip is increased to achieve high-definition sensing, then the sensing area is improved, but the yield ratio decreases due to foreign matter and photolithography defects
Solution Approach 1:
The patent divides a large sensing array into multiple smaller semiconductor sensor chips, each with its own sensor cells arranged in a grid pattern. These smaller chips are then connected through a packaging substrate to form a complete large-area sensor system. This segmentation allows each chip to be manufactured with high yield ratio while the combined system achieves the desired large sensing area for high-definition sensing.
2Area of moving object
If multiple small semiconductor chips are arranged to increase the sensing area, then the sensing area is improved, but the device complexity increases due to electrical connection requirements
Solution Approach 1:
The patent integrates multiple small semiconductor sensor chips onto a single packaging substrate, merging them into a unified sensor array system. The packaging substrate provides common electrical connection structures that simplify the interconnection of multiple chips, reducing overall device complexity while maintaining the large sensing area capability.
Solution Approach 2:
The packaging substrate serves multiple functions: it provides mechanical support for multiple sensor chips, establishes electrical connections between chips and external circuits, and enables the system to function as a unified large-area sensor. This multi-functionality reduces the need for additional specialized components, simplifying the overall device structure.
Data Source
AI summary
The present invention addresses the problem of enlarging a sensing area in an ultrasonic probe so as to achieve a higher definition. This ultrasonic diagnostic equipment is provided with an ultrasonic probe that comprises: a CMUT chip (2a) that has drive electrodes (3e)-(3j), etc., arranged in a grid-like configuration on a rectangular CMUT element section (21); and a CMUT chip (2b) that has drive electrodes (3p)-(3u), etc., arranged in a grid-like configuration on the rectangular CMUT element section (21), that is adjacent to the CMUT chip (2a), and in which the drive electrodes (3e)-(3j) of the adjacent CMUT chip (2a) are electrically connected to the respective drive electrodes (3p)-(3u) via bonding wires (4f)-(4i), etc.