cMUT Ultrasonic Probe Insulation for Electrical Safety
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Solution Overview
Problem
Conventional ultrasonic probes using cMUTs face issues with electrical insulation, leading to potential electrical leakage and safety concerns due to the absence of a ground layer and inadequate acoustic matching layers.
Innovation Solution
The ultrasonic probe incorporates a cMUT chip with an acoustic lens and a backing layer, featuring an insulation configuration that includes an insulating film between the acoustic lens and the cMUT chip, as well as a conductive film acting as a ground layer to prevent electrical leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a ground layer is not provided in cMUT ultrasonic probe, then the device complexity is reduced, but electrical insulation becomes insufficient leading to potential electrical leakage
Solution Approach 1:
The patent introduces an insulating layer as an intermediary component between the electrode and the object side. This insulating layer acts as a mediator that provides the necessary electrical insulation without requiring a complex ground layer structure, thus resolving the contradiction between device simplicity and electrical safety.
Solution Approach 2:
The patent uses a simple insulating layer coating instead of a complex ground layer structure. This approach employs a simpler, more straightforward solution that achieves the insulation function without the need for elaborate grounding systems, effectively trading structural complexity for reliable insulation.
2Device complexity
If an acoustic matching layer is not provided, then the device complexity is reduced, but the insulation construction deteriorates
Solution Approach 1:
The insulating layer serves as an intermediary that simultaneously addresses both acoustic matching and electrical insulation requirements. By positioning this layer at the interface between the ultrasonic wave transmitting/receiving surface and the object, it provides the necessary insulation without requiring separate acoustic matching layers.
Solution Approach 2:
The insulating layer performs multiple functions: it provides electrical insulation, serves as an acoustic matching layer, and maintains structural integrity. This multi-functional component eliminates the need for separate dedicated layers, reducing overall device complexity while maintaining reliable insulation construction.
3Power
If bias voltage is applied to the backing layer side electrode and driving signal to the object side electrode, then ultrasonic wave transmission is improved, but electrical leakage risk increases due to insufficient insulation
Solution Approach 1:
The insulating layer acts as a protective intermediary between the high-voltage electrode system and the object. It allows the full bias voltage and driving signal to be applied for optimal ultrasonic transmission while blocking harmful electrical leakage to the object, thus resolving the contradiction between transmission efficiency and safety.
Solution Approach 2:
The patent converts the potential harmful effect of high voltage application into a beneficial configuration by using the insulating layer to contain and direct the electrical field. The high voltage necessary for effective ultrasonic transmission is maintained while the insulating layer prevents leakage, effectively using the electrical field configuration to improve transmission while the insulation converts the potential harm into a safe operating condition.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances electrical safety by preventing electric leakage to the object, ensuring improved insulation and safety during ultrasonic diagnostics.
Implementation Method 1
a cMUT chip having a plurality of vibration elements wherein electromechanical coupling coefficient or sensitivity varies in accordance with bias voltage, for transmitting/receiving ultrasonic waves
Implementation Method 2
receive the reflected echo signals produced from the object and convert them into electric signals
Implementation Method 3
an acoustic lens provided on the upper part of the cMUT chip
Data Source
AI summary
An ultrasonic probe is disclosed which includes a cMUT chip having a plurality of vibration elements whose electromechanical coupling coefficient or sensitivity is changed according to a bias voltage and transmitting and receiving ultrasonic waves, an acoustic lens arranged above the cMUT chip, and a backing layer arranged below the cMUT chip. An electric leakage preventing unit is provided at the ultrasonic wave transmission/reception surface side of the acoustic lens or between the acoustic lens and the cMUT chip. The electric leakage preventing unit can be, for example, an insulating layer such as a ground layer. Such a structure makes it is possible to provide an ultrasonic probe capable of preventing electric leakage from the ultrasonic probe to an object to be examined so as to improve the electric safety and an ultrasonic diagnostic apparatus using the probe.