Carbon Nanotube Array Metal TIM Thermal Interface
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Solution Overview
Problem
The increasing power consumption of processors poses a challenge for heat management in microelectronic devices, as existing thermal interface solutions face issues with adhesion and thermal conductivity, leading to inefficient heat dissipation.
Innovation Solution
The use of a carbon nanotube (CNT) array integrated with a metal thermal interface material (TIM) is proposed, where the CNT array is grown on the backside surface of a substrate and coated with metallization films, followed by impregnation with a TIM metal third film, such as an indium alloy, to enhance thermal conductivity and adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a polymer-solder hybrid (PSH) is used for thermal interface, then adhesion is improved, but thermal conductivity deteriorates
Solution Approach 1:
The patent employs a composite material structure consisting of carbon nanotubes embedded in a polymer-solder hybrid matrix. The carbon nanotubes provide high thermal conductivity pathways while the PSH matrix ensures strong adhesion to the substrate, thus simultaneously addressing both adhesion and thermal conductivity requirements.
Solution Approach 2:
The carbon nanotubes are strategically positioned within the PSH material to create localized high thermal conductivity regions. This allows the material to maintain strong overall adhesion through the PSH matrix while providing efficient thermal transport pathways through the embedded nanotube network.
2Ease of manufacture
If traditional thermal interface materials are used, then manufacturing simplicity is maintained, but heat dissipation efficiency deteriorates
Solution Approach 1:
The carbon nanotubes are pre-aligned and embedded in the PSH material before the final assembly process. This preliminary structuring of the thermal pathways ensures high heat dissipation efficiency is built into the material itself, rather than requiring complex post-assembly thermal management structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves thermal conductivity, achieving a range of 500 W/m-K to 3,000 W/m-K, outperforming traditional polymer-solder hybrids, and effectively addresses adhesion and thermal stress issues, enabling more efficient heat dissipation in microelectronic devices.
Implementation Method 1
the CNT array is grown on a backside surface of a substrate... achieving a thermal conductivity in a range of about 500 W/m-K to about 3,000 W/m-K
Implementation Method 2
Because of adhesion and thermal conductivity issues, a polymer-solder hybrid (PSH) has been developed... effectively addresses adhesion and thermal stress issues
Data Source
AI summary
A carbon nanotube (CNT) array is patterned on a substrate. The substrate can be a microelectronic die or a heat sink for a die. The patterned CNT array is patterned by using a patterned catalyst on the substrate to form the CNT array by growing. The patterned CNT array can also be patterned by using a patterned mask on the substrate to form the CNT array by growing. A computing system that uses the CNT array for heat transfer from the die is also used.