CNT Thermal Interface Material with Ferric Salt Deposited Graphite
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Solution Overview
Problem
Existing thermal interface materials with carbon nanotube arrays face challenges in achieving uniform dispersion of high heat conduction particles, leading to low heat conduction coefficients, and existing methods result in materials that are either thick and inflexible or have low heat conducting efficiency.
Innovation Solution
A method involving a CNT array soaked in a solution with organic matter and ferric ions, followed by a ferric salt deposit formation, heating, and peeling off the array to create a thin, flexible thermal interface material with uniformly dispersed graphite particles for enhanced heat conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If diffusing particles with high heat conduction coefficient into CNT array, then heat conduction coefficient is improved, but particles cannot be uniformly dispersed and interfaces between particles and CNTs are high, resulting in low heat conduction coefficient
Solution Approach 1:
The patent uses a polymer matrix as an intermediary medium to uniformly disperse high heat conduction particles (such as graphite, boron nitride, or metal particles) throughout the CNT array. The polymer acts as a carrier that facilitates uniform distribution while maintaining thermal contact between particles and CNTs, resolving the issue of non-uniform dispersion and high interface resistance.
Solution Approach 2:
The patent creates a composite thermal interface material combining CNTs, high heat conduction particles, and polymer matrix. This composite structure allows the high heat conduction particles to be uniformly distributed within the CNT array while the polymer matrix provides structural support and maintains thermal pathways, achieving both uniform dispersion and high heat conduction coefficient.
2Ease of manufacture
If using injection molding to fill CNT array with polymer material, then manufacturing is simplified, but the material becomes relatively thick, reducing flexibility and heat conducting efficiency
Solution Approach 1:
The patent performs preliminary actions by pre-forming the CNT array with high heat conduction particles embedded within it before final assembly. The particles are incorporated into the CNT array structure in advance, allowing the thermal interface material to achieve optimal thermal conductivity in a thin configuration without requiring thick polymer filling, thus maintaining flexibility and heat conducting efficiency.
3Ease of manufacture
If using injection molding with polymer material, then manufacturing is simplified, but heat conducting efficiency is reduced due to polymer filling
Solution Approach 1:
The patent applies local quality by concentrating high heat conduction particles specifically at the interfaces and within the CNT array where thermal contact is most critical, rather than uniformly filling the entire structure with polymer. This localized distribution of thermal conductive materials maximizes heat conducting efficiency while minimizing the overall polymer content that would otherwise reduce thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method results in a thermal interface material with improved heat conducting efficiency, reduced thermal resistance, and increased flexibility, suitable for modern electronic components with high heat dissipation requirements.
Implementation Method 1
providing a first solution with organic matter and ferric ion; soaking the CNT array into the first solution for a period of time; dipping a second solution into the first solution to form a ferric salt deposit
Implementation Method 2
taking out the CNT array, and then heating the CNT array in inert gas
Data Source
AI summary
A method for making a thermal interface material includes: providing a CNT array on a substrate; providing a first solution with organic matter and ferric ion; soaking the CNT array into the first solution for a period of time; dipping a second solution into the first solution to form a ferric salt deposit; taking out the CNT array, and then heating the CNT array in inert gas; and cooling and peeling off the CNT array from the substrate, and finally achieving a thermal interface material. The thermal interface material made by the present method has a high heat conducting efficiency.