Carbon Nanotube Heat Dissipation Sheet With Ultrathin Adhesive Layers

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Solution Overview

Problem

Existing heat dissipation sheets face challenges in achieving both favorable thermal conductivity and adhesiveness between heating and heat dissipation elements, as evidenced by the limitations in the transfer sheet disclosed in International Publication Pamphlet No. WO 2018/110255.

Innovation Solution

A heat dissipation sheet comprising a carbon nanotube layer with a surface density of 1×10^10 pieces/cm², embedded with thin adhesive resin layers on both ends of the carbon nanotubes, ensuring adhesiveness and thermal conductivity by maintaining the adhesive resin thickness below 1 µm to prevent exposure of the carbon nanotube ends, which are integrated with release sheets for easy application.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If the adhesive resin layer is made thicker to ensure adhesiveness to heating and heat dissipation elements, then adhesiveness is improved, but thermal conductivity deteriorates due to increased thermal resistance

Engineering Contradiction:
ImproveadhesivenessVSAvoidthermal conductivity
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The patent optimizes the thickness parameter of the adhesive resin layer to be 1 µm or less, transforming it from a thick adhesive layer to an ultrathin functional layer. This parameter change simultaneously achieves sufficient adhesiveness while minimizing thermal resistance, resolving the contradiction between strength and thermal conductivity

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite structure where ultrathin adhesive resin layers are combined with carbon nanotube layers. The adhesive resin provides bonding functionality while the carbon nanotubes provide high thermal conductivity, achieving both adhesiveness and thermal conductivity through material composition

Inventive Principle:
Principle #40Composite materials

2Reliability

If the adhesive resin layer is made thinner to improve thermal conductivity, then thermal conductivity is improved, but adhesiveness deteriorates

Engineering Contradiction:
Improvethermal conductivityVSAvoidadhesiveness
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent identifies and optimizes critical parameters including adhesive resin thickness (≤1 µm), carbon nanotube surface density (1×10¹⁰ pieces/cm²), and carbon nanotube length (1 µm to 100 µm). These parameter changes enable the ultrathin adhesive layer to maintain adequate adhesiveness while achieving low thermal resistance

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The composite structure integrates adhesive resin with carbon nanotubes, where the carbon nanotubes serve dual functions: reinforcing the adhesive layer to maintain bonding strength and providing high thermal conductivity pathways, thus resolving the contradiction between thinness and functional performance

Inventive Principle:
Principle #40Composite materials

3Reliability

If carbon nanotubes are used to improve thermal conductivity, then thermal conductivity is improved, but manufacturing complexity increases due to precise control requirements

Engineering Contradiction:
Improvethermal conductivityVSAvoidmanufacturing complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent establishes specific parameter ranges for carbon nanotubes (surface density of 1×10¹⁰ pieces/cm², length of 1 µm to 100 µm) that balance thermal conductivity performance with manufacturability. These parameter specifications provide clear manufacturing targets while ensuring adequate thermal performance

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent applies different properties to different parts of the heat dissipation sheet: the adhesive resin layers have optimized thickness for bonding, the carbon nanotube layers have controlled density and orientation for thermal conduction, and release sheets are positioned for ease of application. This local optimization achieves overall performance while simplifying manufacturing

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides enhanced adhesiveness and thermal conductivity between heating and heat dissipation elements, allowing for efficient heat conduction while maintaining flexibility and ease of handling during installation.

Implementation Method 1

a plurality of carbon nanotubes disposed in an extension direction substantially perpendicular to the first surface and the second surface

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a first adhesive resin layer embedded between the first surface and the first end surface of the plurality of carbon nanotubes, and a second adhesive resin layer embedded between the second surface and the second end surface of the plurality of carbon nanotubes

Methodology Applied
Scientific EffectAdhesion: Adhesive

Data Source

PatentEP3831595B1Heat dissipation sheet and method of manufacturing heat dissipation sheet
Publication Date: 2025.12.31 FUJITSU LTD
  • EP3831595B1 patent drawingFigure 1
  • EP3831595B1 patent drawingFigure 2
  • EP3831595B1 patent drawingFigure 3

AI summary

A heat dissipation sheet includes a carbon material layer configured to include a plurality of linear carbon materials arranged in parallel with each other, an adhesive resin layer configured to include a first surface to be in contact with an end of each of the plurality of linear carbon materials, a thickness of the adhesive resin layer being less than 1 µm, and a release sheet configured to be in contact with a second surface among a plurality of surfaces of the adhesive resin layer, the second surface being over a side opposite to the first surface.