Carbon Nanotube N-Type Conversion via Conjugated Polymer Attachment

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Solution Overview

Problem

Current methods for converting carbon nanotube (CNT) field-effect transistors (FETs) into n-type semiconductor devices are complex and costly, often requiring vacuum heating, ion doping, or additional steps for forming polarizable thin films, which increase production time and cost.

Innovation Solution

A carbon nanotube composite with a conjugated polymer attached to its surface and an organic compound with a carbon-nitrogen bond is used, integrated into a semiconductor device structure with a bottom-gate or top-gate configuration, simplifying the production process by eliminating the need for additional doping or heating steps.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If vacuum heating treatment or ion doping is used to convert CNT-FET into n-type semiconductor device, then the semiconductor type is converted, but the production process becomes complex and costly

Engineering Contradiction:
Improvesemiconductor type conversionVSAvoidproduction process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent changes the chemical parameters of the CNT surface by attaching conjugated polymers with specific functional groups (electron-withdrawing groups) to convert the semiconductor type from p-type to n-type. This chemical modification approach replaces complex physical processes like vacuum heating and ion doping, simplifying the production process while achieving the desired semiconductor type conversion.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent introduces conjugated polymers as intermediary substances that attach to the CNT surface to mediate the conversion from p-type to n-type semiconductor. These polymers act as a bridge, providing electron withdrawal through their functional groups to change the electrical characteristics without requiring direct ion doping or high-temperature vacuum treatment.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If additional steps for forming polarizable thin films are added to create n-type FET, then the n-type characteristics are achieved, but the production time increases

Engineering Contradiction:
Improven-type characteristicsVSAvoidproduction time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent merges the semiconductor type conversion process with the existing CNT-FET fabrication process by incorporating conjugated polymer attachment during the same production step. This eliminates the need for separate vacuum heating or ion doping steps, achieving n-type characteristics without increasing production time.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent performs the semiconductor type conversion action preliminarily by pre-attaching conjugated polymers with electron-withdrawing groups to the CNT surface before final device assembly. This preliminary chemical modification ensures n-type characteristics are established early in the process, avoiding time-consuming post-processing steps.

Inventive Principle:
Principle #10Preliminary action

3Adaptability or versatility

If different materials are selected for p-type FET and n-type FET to form complementary circuit, then the complementary circuit functionality is achieved, but the production efficiency decreases and cost increases

Engineering Contradiction:
Improvecomplementary circuit functionalityVSAvoidproduction efficiency
Core Design Contradiction:
Adaptability or versatilityVSProductivity

Solution Approach 1:

The patent achieves universality by using the same base material (CNT) for both p-type and n-type FETs in the complementary circuit. By controlling the surface chemistry through selective polymer attachment, the same CNT-FET structure can function as either p-type or n-type, eliminating the need for different semiconductor materials and simplifying production.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent applies local quality modification by attaching different conjugated polymers with specific functional groups to specific CNT-FETs based on the desired semiconductor type. This localized chemical modification allows p-type and n-type devices to be created from the same base material through targeted surface functionalization, maintaining production efficiency while achieving complementary circuit functionality.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the production of n-type semiconductor devices and complementary devices in simpler processes, reducing production costs and time while maintaining high functionality for wireless communication applications.

Implementation Method 1

Non-Patent Document 2 is a study on charge transfer interaction between amine-containing molecules

Methodology Applied
Scientific EffectCharge transfer interaction:

Implementation Method 2

the second insulating layer contains an organic compound containing a bond between a carbon atom and a nitrogen atom

Methodology Applied
Scientific EffectChemical bonding: Chemical Bonding

Data Source

PatentEP3410468B1N-type semiconductor element, complementary type semiconductor device and method for manufacturing the same, and wireless communication device in which the same is used
Publication Date: 2024.07.10 TORAY INDUSTRIES INC
  • EP3410468B1 patent drawingFigure 1~2
  • EP3410468B1 patent drawingFigure 3~4
  • EP3410468B1 patent drawingFigure 5(a)~5(e)

AI summary

An excellent complementary semiconductor device is provided using a simple process. An n-type drive semiconductor device including a substrate; and a source electrode, a drain electrode, a gate electrode, a gate insulating layer, and a semiconductor layer on the substrate; and including a second insulating layer on the opposite side of the semiconductor layer from the gate insulating layer; in which the second insulating layer contains an organic compound containing a bond between a carbon atom and a nitrogen atom; and in which the semiconductor layer contains a carbon nanotube composite having a conjugated polymer attached to at least a part of the surface thereof.