Stacked Carbon Nanotube Heat Dissipation Sheet for Chip Warpage
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Solution Overview
Problem
Current heat dissipation materials, such as indium sheets, are costly and have limited thermal conductivity, while carbon nanotube-based sheets face challenges in maintaining thickness and following warpage or deformation of semiconductor chips and heat spreaders, leading to inefficient heat dissipation.
Innovation Solution
A heat dissipation sheet comprising a stacked structure of first and second carbon nanotube sheets, where the first sheet with high-temperature treatment has low deformation and high thermal conductivity, and the second sheet with densification has high deformation, allowing it to follow warpage while maintaining sheet thickness and thermal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a single carbon nanotube sheet is used for heat dissipation, then thermal conductivity is improved, but the sheet cannot maintain both thickness and adaptability to warpage simultaneously
Solution Approach 1:
The heat dissipation sheet is divided into multiple independent carbon nanotube sheets (first sheet, second sheet, etc.) that are stacked together. Each sheet can deform independently, allowing the overall structure to maintain thickness while adapting to warpage through the collective deformation of individual sheets.
Solution Approach 2:
The invention creates a composite structure by stacking multiple carbon nanotube sheets with different properties. The combination of multiple sheets provides both the thermal conductivity of carbon nanotubes and the adaptability to warpage, achieving a performance composite that neither single sheet could provide alone.
2Adaptability or versatility
If carbon nanotube sheets are made thinner to improve flexibility, then adaptability to warpage is improved, but sheet thickness and structural integrity deteriorate
Solution Approach 1:
Instead of making a single thin sheet, the invention segments the thickness dimension into multiple thin sheets stacked together. Each individual sheet remains thin and flexible for warpage adaptation, while the stacked configuration collectively maintains sufficient total thickness for structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively ensures sufficient heat dissipation performance by allowing the heat dissipation sheet to adapt to warpage or deformation of semiconductor chips and heat spreaders, maintaining low thermal resistance and durability.
Implementation Method 1
the first carbon nanotubes and the second carbon nanotubes are different in an amount of deformation when pressure is applied
Implementation Method 2
a heat spreader composed of a material having high thermal conductivity... set directly on the semiconductor chip
Data Source
AI summary
A heat dissipation sheet includes a first sheet composed of a plurality of first carbon nanotubes, and a second sheet composed of a plurality of second carbon nanotubes, wherein the first sheet and the second sheet are coupled in a stacked state, and the first carbon nanotubes and the second carbon nanotubes are different in an amount of deformation when pressure is applied.