Carbon Nanotube Bonding Structure With Sintered Metal Contact
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Solution Overview
Problem
Existing bonding structures using carbon nanotubes and metal pastes or brazing metals often result in weak bonding strengths due to inadequate interfacial contact and the presence of polymer films, which increase thermal and electric resistance.
Innovation Solution
A bonding structure is developed that includes a plurality of carbon nanotubes bonded to a first bonded member using a first metal sintered compact, which enters spaces between the carbon nanotubes and covers their side and end faces, thereby enhancing the bonding strength and reducing thermal and electric resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If metal paste or brazing metal is used to bond carbon nanotubes to bonded members, then bonding is achieved, but bonding strength is weak due to inadequate interfacial contact and presence of polymer films
Solution Approach 1:
The patent changes the physical and chemical parameters of the bonding material by using metal nanoparticles (0.1-10 μm) instead of conventional metal paste or brazing metal. This particle size parameter change enables the metal to penetrate and fill the spaces between carbon nanotubes, creating intimate interfacial contact. The nanoparticle form also eliminates polymer film formation, directly resolving the bonding strength and reliability contradiction.
Solution Approach 2:
The metal nanoparticles are nested within the spaces between carbon nanotubes, with the nanoparticles fitting into the inter-tubular voids. This nesting arrangement ensures maximum interfacial contact area between the metal bonding agent and carbon nanotube surfaces, eliminating the inadequate contact problem and preventing polymer film formation that would increase thermal and electric resistance.
2Reliability
If conventional metal paste is used for bonding, then bonding is achieved, but polymer films form that increase thermal and electric resistance
Solution Approach 1:
The patent extracts and eliminates the polymer component from the bonding material formulation. By using pure metal nanoparticles without polymer binders or organic vehicles, the invention removes the source of polymer film formation that causes increased thermal and electric resistance. This extraction directly improves reliability while the metal nanoparticles provide sufficient bonding strength through mechanical interlocking and metallurgical bonding.
Solution Approach 2:
The invention changes the compositional parameter of the bonding material from a polymer-based metal paste to pure metal nanoparticles. This parameter change eliminates polymer film formation entirely, resolving the thermal and electric resistance issue. The metal nanoparticles maintain bonding strength through direct metal-to-carbon nanotube contact and sintering.
3Strength
If metal particles are used to bond carbon nanotubes, then bonding strength improves, but manufacturing complexity increases
Solution Approach 1:
The metal nanoparticles exhibit self-assembly behavior during the bonding process. When applied to carbon nanotubes and heated, the nanoparticles automatically distribute themselves into the spaces between nanotubes and sinter together without requiring complex external processing. This self-service characteristic simplifies manufacturing while achieving strong bonding, as the nanoparticles perform their own positioning and bonding functions.
Solution Approach 2:
The bonding process utilizes the phase transition of metal nanoparticles from discrete particles to sintered compact during heating. This phase transition occurs at relatively low temperatures and automatically creates strong bonds between carbon nanotubes and the bonded member. The phase transition mechanism simplifies manufacturing by eliminating the need for high-pressure or high-temperature processing equipment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed bonding structure achieves improved bonding strength between carbon nanotubes and bonded members, reduces thermal and electric resistance, and prevents fire damage due to heat generation, thereby enhancing the reliability and performance of heat dissipation structures.
Implementation Method 1
a first metal sintered compact bonding first end portions of the plurality of carbon nanotubes and the first bonded member
Implementation Method 2
firing the first metallic nanopaste
Data Source
AI summary
A bonding structure includes: a plurality of carbon nanotubes; a first bonded member; and a first metal sintered compact bonding first end portions of the plurality of carbon nanotubes and the first bonded member, wherein the first metal sintered compact enters spaces between the first end portions of the plurality of carbon nanotubes, and bonds to the plurality of carbon nanotubes while covering side faces and end faces of the first end portions of the plurality of carbon nanotubes.