CNT Pattern Wiring Structure for Transparent Low-Resistance Heaters

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Solution Overview

Problem

Existing CNT wiring technologies face challenges in achieving both low resistance and high light transmittance due to the inherent relationship between sheet resistance and light transmittance, making it difficult to form CNT conductive films that are both conductive and transparent.

Innovation Solution

The CNT pattern wiring features a line-and-space configuration with CNT lines having a height of 1 μm or more, alternating with openings, allowing for high light transmittance while reducing sheet resistance by setting the formation ratio of the opening to 90% or more and optimizing the width and height of the CNT lines.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a CNT conductive film is formed to reduce sheet resistance, then electrical conductivity is improved, but light transmittance deteriorates

Engineering Contradiction:
Improveelectrical conductivityVSAvoidlight transmittance
Core Design Contradiction:
ReliabilityVSIllumination intensity

Solution Approach 1:

The invention transitions from a two-dimensional CNT film to a three-dimensional line-and-space structure with CNT lines having height of 1 μm or more. This vertical dimension allows light to pass through the openings between lines while maintaining conductive pathways along the CNT lines, thereby achieving both low sheet resistance and high light transmittance simultaneously

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The CNT lines are arranged in a line-and-space pattern where different regions have different functions: the CNT lines provide electrical conductivity while the openings between lines allow light transmission. This spatial differentiation of properties enables simultaneous optimization of both electrical and optical characteristics

Inventive Principle:
Principle #3Local quality

2Illumination intensity

If the formation ratio of openings is increased to improve light transmittance, then transparency is improved, but sheet resistance increases

Engineering Contradiction:
Improvelight transmittanceVSAvoidsheet resistance
Core Design Contradiction:
Illumination intensityVSReliability

Solution Approach 1:

By introducing the height dimension (1 μm or more) and creating a line-and-space three-dimensional structure, the invention enables high light transmittance through openings while maintaining low sheet resistance through the vertical conductive pathways of the CNT lines, breaking the traditional inverse relationship between these parameters

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Illumination intensity

If CNT lines are made thinner to improve transparency, then light transmittance is improved, but electrical conductivity deteriorates

Engineering Contradiction:
Improvelight transmittanceVSAvoidelectrical conductivity
Core Design Contradiction:
Illumination intensityVSReliability

Solution Approach 1:

The invention compensates for reduced CNT line width by increasing the height to 1 μm or more, creating a three-dimensional structure where the vertical dimension provides sufficient conductive cross-section for low resistance while the reduced horizontal width allows higher light transmittance through the openings

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS12150218B2Carbon nano-tube pattern wiring, transparent conductive substrate, and heater having the same
Publication Date: 2024.11.19 DENSO CORP
  • US12150218B2 patent drawing
  • US12150218B2 patent drawing
  • US12150218B2 patent drawing

AI summary

The wiring includes a substrate having one surface and a CNT pattern having multiple CNT lines which are made of a line-shape CNT on the surface and have a height of 1 μm or more. In the cross section taken along one direction on the one surface, the CNT pattern wiring is a line-and-space film in which the opening is located between the plurality of adjacent CNT lines.