Co-fired Ceramic Passive Integrated Circuit Devices
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Solution Overview
Problem
The semiconductor industry faces challenges in miniaturizing passive devices like capacitors and inductors, which are not scaled down as efficiently as transistors, leading to increased circuit size and reliability issues due to bulky PCB traces and discrete packaging, particularly in mobile and cellular applications where space is limited.
Innovation Solution
A method of forming and bonding multiple passive devices, such as inductors and capacitors, onto a circuit substrate using ceramic materials in a paste or semiliquid form, followed by a low-temperature or high-temperature co-firing process, allowing for compact and reliable integration with active devices, reducing trace length and improving yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If passive devices are mounted on a printed circuit board with conductive traces, then electrical connection between devices is achieved, but the circuit footprint increases and device density decreases
Solution Approach 1:
The patent combines passive devices and active devices into a single integrated circuit package, eliminating the need for separate PCB mounting and trace connections. This merging of previously separate components directly reduces the overall circuit footprint while maintaining reliable electrical connections through integrated bonding structures.
Solution Approach 2:
The patent transitions from a two-dimensional PCB layout to a three-dimensional integrated package structure. By stacking passive devices above the substrate and using vertical bonding connections, the design moves connections into the third dimension, significantly reducing the planar footprint while maintaining connection reliability.
2Area of stationary object
If passive devices are scaled down to reduce circuit size, then space is reduced, but capacitance or inductance decreases significantly
Solution Approach 1:
The patent employs composite material structures for passive devices, combining multiple materials with complementary properties to maintain electrical characteristics at smaller sizes. The integrated package uses composite construction that preserves capacitance and inductance values while reducing overall device footprint.
Solution Approach 2:
The patent modifies physical and geometric parameters of passive devices within the integrated structure, such as adjusting trace widths, layer spacing, and component geometries, to optimize capacitance and inductance values at reduced sizes. These parameter changes allow scaling down while maintaining functional performance.
3Adaptability or versatility
If discrete passive devices are used with PCB traces, then device functionality is achieved, but the density of devices on the PCB decreases
Solution Approach 1:
The patent merges multiple discrete devices into a single integrated package containing both active and passive components. This consolidation maintains all required functionalities while dramatically increasing device density by eliminating the need for separate PCB mounting of each component.
Solution Approach 2:
The integrated package serves multiple functions simultaneously, housing both active circuit devices and passive components (capacitors, inductors, resistors) in a single unit. This multi-functionality eliminates the need for separate discrete components, thereby increasing overall device density while preserving all necessary functionalities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables a cost-effective and reliable method for forming compact passive device packages, reducing circuit size, enhancing reliability, and improving the integration of passive and active devices, particularly beneficial for mobile and cellular applications by minimizing space usage and reducing the risk of solder-point failures.
Implementation Method 1
A method of forming and bonding multiple passive devices, such as inductors and capacitors, onto a circuit substrate using ceramic materials in a paste or semiliquid form, followed by a low-temperature or high-temperature co-firing process
Data Source
AI summary
Co-fired integrated circuit devices and methods for fabricating and integrating such on a workpiece are disclosed herein. An exemplary method includes forming a first passive device and a second passive device over a carrier substrate. The first passive device and the second passive device each include at least one material layer that includes a co-fired ceramic material. The carrier substrate is removed after performing a co-firing process to cause chemical changes in the co-fired ceramic material. The first passive device may include a conductive loop disposed between a first magnetic layer and a second magnetic layer. The first magnetic layer, the second magnetic layer, or both includes a co-fired ceramic magnetic material. The second passive device may include a first conductive layer and a second conductive layer separated by a dielectric layer. The first conductive layer, the second conductive layer, or both includes a co-fired ceramic conductive material.