Co-modified Organopolysiloxane Adhesive for Semiconductor Wafer Fixing
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Solution Overview
Problem
Existing organopolysiloxane pressure-sensitive adhesive compositions lack the necessary balance between initial adhesive strength for temporary fixing and easy peelability, often resulting in process defects due to insufficient adhesion or residue issues during semiconductor wafer processing and electronic device assembly.
Innovation Solution
A chain co-modified organopolysiloxane with both heat-curable and photo-curable properties, containing a silicon-bonded acryl or methacryl group and an alcoholic hydroxyl group at specific ratios, which undergoes a two-stage curing process to achieve necessary adhesive strength followed by easy releasability through photo-curing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a slightly tacky pressure-sensitive adhesive is used to enable easy peelability, then the ease of removal is improved, but the pressure-sensitive adhesive strength for temporary fixing deteriorates
Solution Approach 1:
The adhesive composition is segmented into two distinct curing stages: heat curing for initial adhesion and UV curing for final release. This temporal segmentation allows the adhesive to provide strong initial bonding through heat-cured organopolysiloxane bonds, then enable easy removal after UV curing transforms the adhesive properties
Solution Approach 2:
Heat curing is performed as a preliminary action before UV curing to establish sufficient initial adhesive strength for temporary fixing. The heat-cured organopolysiloxane provides the necessary bonding strength initially, and subsequent UV curing modifies the adhesive to enable easy peelability
2Reliability
If high pressure-sensitive adhesive strength is used for sufficient fixing, then the reliability of temporary fixing is improved, but the ease of removal deteriorates due to difficulty in peeling or adhesive residue
Solution Approach 1:
The adhesive properties are changed through parameter transformation from heat curing to UV curing. Heat curing establishes strong adhesion through organopolysiloxane bond formation, while subsequent UV curing changes the chemical state of the adhesive to enable easy removal, transforming the adhesive from a strong-bonding state to a release-ready state
3Reliability
If conventional organopolysiloxane pressure-sensitive adhesive compositions are used, then the electrical insulation and heat resistance are improved, but the balance between adhesive strength and peelability deteriorates
Solution Approach 1:
The invention creates a composite adhesive system combining heat-cured organopolysiloxane with UV-curable components. This composite approach maintains the excellent electrical insulation and heat resistance of organopolysiloxane while adding UV curability to achieve the desired balance between initial adhesive strength and subsequent peelability
Solution Approach 2:
The adhesive composition achieves multi-functionality by incorporating both heat-curing and UV-curing capabilities. The same adhesive layer provides temporary fixing through heat curing and enables easy removal through UV curing, making it suitable for multiple stages of semiconductor wafer processing with different adhesive requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a pressure-sensitive adhesive layer with initial sufficient adhesion during heat curing and easy peelability after photo-curing, ensuring effective temporary fixing and protection in semiconductor and electronic device manufacturing processes without residue.
Implementation Method 1
a silicon-bonded acryl group or a silicon-bonded methacryl group
Implementation Method 2
an alcoholic hydroxyl group at a specific ratio in a molecule, and having both heat curability and photo-curability
Data Source
AI summary
Provided is an organopolysiloxane compound serving as a raw material of an organopolysiloxane pressure-sensitive adhesive which has necessary and sufficient pressure-sensitive adhesive strength in a step such as temporary fixing or the like and can be easily peeled off from a substrate in a subsequent step; an organopolysiloxane pressure-sensitive adhesive composition containing the same; and a method for using the same. A chain co-modified organopolysiloxane containing a specific functional group having a (meth)acryl group (RA) and a functional group having an alcoholic hydroxyl group (ROH), wherein the amount of RA is in the range of 0.10 to 10.0 mol % with regard to all silicon atom-bonded functional groups in the molecule, and the average amount of ROH is in a range of 0.1 to 1.0 moles per mole of RA.