Co-Optical Package Opening Structure for Precise Optical Alignment
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Solution Overview
Problem
Existing silicon photonic technology struggles to effectively introduce optical signals without loss, and fails to integrate electronic, photonic, and optical elements within a single module or circuit structure, lacking mechanisms for precise alignment and stable connection.
Innovation Solution
A co-optical package integrating a circuit structure with embedded photonic and electronic elements, featuring a tapered opening and encapsulation layer, along with an optical element aligned to the photonic element's active surface, facilitating rapid alignment and signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical coupling methods (microlenses, grating couplers) are used to introduce optical signals, then optical signal transmission can be achieved, but signal loss occurs and alignment precision is insufficient
Solution Approach 1:
The patent introduces an intermediary structure (the opening in the circuit structure) that mediates between the optical element and the photonic element. This opening serves as a dedicated optical interface that enables efficient light coupling while minimizing signal loss, resolving the contradiction between achieving reliable optical transmission and reducing energy loss.
Solution Approach 2:
The patent performs preliminary alignment actions by pre-forming the opening in the circuit structure at the precise location where the optical element will be positioned. This preliminary structural preparation ensures that when the optical element is installed, it automatically achieves proper alignment with the photonic element, eliminating the need for complex post-installation alignment procedures and reducing signal loss.
2Adaptability or versatility
If electronic elements, photonic elements and optical elements are integrated into a single package, then integration degree increases, but alignment precision and connection stability become difficult to achieve
Solution Approach 1:
The patent merges the circuit structure, optical element, and photonic element into a single integrated package. The opening in the circuit structure is specifically designed to accommodate the optical element, creating a unified structure that maintains high integration degree while ensuring precise alignment through the predetermined opening geometry.
Solution Approach 2:
The patent applies local quality by creating a specialized opening structure at the specific location where the optical element needs to be positioned. This localized structural feature (the opening) provides precise alignment guidance for the optical element, ensuring high manufacturing precision at the critical optical interface while maintaining the overall integrated package design.
3Adaptability or versatility
If conventional integration methods are used, then electronic and photonic elements can be combined, but optical elements cannot be effectively integrated with precise alignment
Solution Approach 1:
The patent segments the circuit structure by creating a distinct opening region that is separate from the main circuit pathways. This segmentation allows the optical element to be positioned and aligned independently within the opening, achieving precise optical alignment while maintaining the integration of electronic and photonic elements in the overall package.
4Ease of operation
If optical fibers are directly docked to photonic elements, then connection simplicity increases, but connection stability and signal transmission quality deteriorate
Solution Approach 1:
The patent introduces the opening in the circuit structure as an intermediary that facilitates stable optical fiber docking to the photonic element. This intermediate structure provides a dedicated interface that ensures both connection simplicity and long-term stability, resolving the contradiction between ease of connection and connection reliability.
Data Source
AI summary
A co-optical package and a manufacturing method thereof are provided. An electronic module includes a circuit structure, an electronic element and a photonic element. The circuit structure has a first side and a second side opposite to the first side. The electronic element is embedded in the circuit structure or disposed on the first side of the circuit structure. The photonic element having an optical active surface is embedded in the circuit structure and electrically connected to the electronic element. A portion of the circuit structure is removed from the first side to form an opening to expose the optical active surface of the photonic element. An optical element is disposed at the opening of the circuit structure and combined with the optical active surface of the photonic element. An encapsulation layer is formed on the first side of the circuit structure and covers the optical element.