Co-package optics attachment using electromagnetic radiation absorption material
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Solution Overview
Problem
The coupling of photonic integrated circuits to optical fibers is not as advanced as electronic ICs, facing challenges such as wavelength, signal losses, assembly tolerance, and polarization characteristics, and there is a need for high bandwidth optical communications at low energy to support AI, cloud, and high-performance computing applications.
Innovation Solution
A co-package optics structure using an electromagnetic radiation absorption material layer for attaching optical links or waveguide structures to photonic integrated chips, allowing for permanent or non-permanent attachment, enabling easy replacement of defective components and supporting high bandwidth communications with low energy consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of repair
If traditional attachment methods are used to couple optical fibers to photonic integrated circuits, then assembly is simple, but replacement of defective components is difficult
Solution Approach 1:
The attachment structure is segmented into multiple functional layers: a permanent attachment layer (adhesive or fusion bond) for structural stability, and a removable release layer (electromagnetic radiation absorption material) for component replacement. This segmentation allows the optical link to be permanently secured while enabling easy replacement through selective removal of the release layer using laser ablation or other removal techniques.
Solution Approach 2:
The electromagnetic radiation absorption material layer serves as an intermediary between the permanent attachment layer and the optical link. This intermediary layer provides the unique property of being both structurally integrated (allowing permanent attachment) and selectively removable (enabling replacement), thus mediating between the conflicting requirements of permanence and replaceability.
2Reliability
If permanent attachment is used to secure optical links, then reliability is improved, but rework capability is lost
Solution Approach 1:
The attachment structure transitions from a static permanent bond to a dynamic system with two distinct states: a permanent attachment state for operational reliability, and a removable state for rework capability. The electromagnetic radiation absorption material layer enables this dynamic behavior by being permanently bonded during operation but selectively removable when rework is needed, allowing the system to adapt between these two states.
3Manufacturing precision
If complex alignment procedures are used to achieve precise coupling, then coupling precision is improved, but assembly time increases
Solution Approach 1:
Alignment features (such as V-grooves, ridges, or patterned structures) are pre-formed on the photonic integrated circuit substrate before the optical link is attached. This preliminary action establishes precise geometric relationships and tolerance zones in advance, allowing the optical link to be positioned accurately without requiring complex real-time alignment procedures during assembly, thus reducing assembly time while maintaining coupling precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the coupling of photonic integrated circuits to optical fibers, facilitating high bandwidth communications at low energy, supporting AI and high-performance computing applications by allowing for efficient testing and replacement of defective components, thereby improving the reliability and efficiency of optical connections.
Implementation Method 1
an electromagnetic radiation absorption material layer for attaching an optical link and/or waveguide structure to a coupling area that is located on a photonic integrated chip
Implementation Method 2
high lambda absorption from targeted wavelength of electromagnetic radiation to cause ablation and/or removal of a defective component
Data Source
AI summary
Co-package optics structures are provided in which an electromagnetic radiation absorption material layer is used to attach an optical link and/or waveguide structure to a coupling area that is located on a photonic integrated chip. The electromagnetic radiation absorption material layer can provide permanent or a non-permanent attachment between the optical link and/or waveguide structure and the coupling area of the photonic integrated chip. In the non-permanent embodiment, testing can be performed to determine whether the optical link and/or waveguide structure is defective, and if determined to be defective, the defective optical link and/or waveguide structure can be replaced by a replacement optical link and/or waveguide structure by removing the electromagnetic radiation absorption material layer that attaches the defective structure.