Co-Packaged Optical Module With TSV Interconnects

The patent transitions from traditional 2D side-by-side component placement to a 3D stacked architecture where optical components (light engine chiplets) are vertically positioned above electrical components (switch processor) on the same substrate. This vertical stacking enables multiple components to occupy the same lateral footprint, dramatically reducing board area while maintaining manufacturability through established TSV and flip-chip bonding processes.

The patent implements localized electrical interconnection through TSVs that provide direct vertical pathways between corresponding pads on the switch processor and light engine chiplets. This localized connection eliminates the need for long wire bonds that traverse across the substrate, significantly reducing electrical path length, inductance, and associated energy losses while maintaining ease of manufacture through standard semiconductor fabrication techniques.

The patent replaces the mechanical wire bond interconnection system with an integrated TSV-based electrical pathway embedded within the substrate. This substitution eliminates the mechanical wire bond structure that creates impedance mismatch and inductance at high frequencies, providing a more reliable, low-inductance connection that maintains signal integrity while remaining compatible with standard manufacturing processes.

The patent merges optical and electrical functional domains into a single co-packaged module by integrating light engine chiplets (optical) with a switch processor (electrical) on the same substrate through vertical stacking. This consolidation enables direct optical-electrical interaction with minimal interconnect length, dramatically increasing bandwidth capacity and data transmission speed while maintaining ease of manufacture through established packaging techniques.