Co-Packaged Optics Architecture With Interposer-Based EIC–PIC Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Forming connections between substrates in semiconductor devices poses challenges, particularly in integrating electronic and photonic integrated circuits, which can lead to difficulties in thermal, physical, and electrical protection, as well as increased computational complexity.
Innovation Solution
A system is developed that includes a supportive interchange with a photonic integrated circuit positioned between compute devices, connected via optical fiber and redistribution layers, allowing for efficient communication and protection of the integrated circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple integrated circuits on multiple substrates are combined into a single unit, then computational power is increased, but packaging complexity and difficulty of connection increase
Solution Approach 1:
The system divides the computational unit into separate substrates, each containing specific integrated circuits (EICs and/or PICs), and connects them through an interposer. This segmentation allows independent optimization of each substrate while achieving overall computational enhancement through inter-substrate connectivity.
Solution Approach 2:
An interposer is introduced as an intermediary component between multiple substrates to facilitate connections. The interposer provides a standardized interface and routing structure that simplifies the complexity of directly connecting multiple different substrates, enabling modular assembly while maintaining high computational power.
2Power
If connections are formed between substrates, then computational power is increased, but thermal, physical and electrical protection becomes more difficult
Solution Approach 1:
The interposer serves as a protective intermediary layer between substrates, providing thermal management pathways, mechanical support, and electrical isolation. This mediator structure protects the vulnerable substrate connections from direct exposure to harsh environments while maintaining signal integrity and thermal performance.
Solution Approach 2:
The packaging system employs composite material structures combining different materials with complementary properties - such as thermally conductive materials for heat dissipation, mechanically robust materials for physical protection, and electrically insulating materials for electrical isolation. This composite approach simultaneously addresses multiple protection requirements.
3Adaptability or versatility
If photonic integrated circuits are embedded within the supportive interchange, then integration is enhanced, but manufacturing precision requirements increase
Solution Approach 1:
The interposer is pre-formed with predetermined embedding structures, cavities, and alignment features before the EICs and PICs are mounted. This preliminary preparation of the interposer structure simplifies the subsequent embedding process, reducing the precision requirements during assembly while maintaining high integration quality.
Solution Approach 2:
The interposer acts as a precision intermediary platform that provides built-in alignment references and positioning structures. These features compensate for minor variations in component placement, reducing the overall manufacturing precision requirements while ensuring accurate integration of photonic and electronic circuits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the integration of EICs and PICs by reducing latency, improving speed, and providing thermal, electrical, and mechanical protection while maintaining efficient signal transmission.
Implementation Method 1
An optical fiber connection may couple to the photonic integrated circuit between the first compute device and the second compute device
Data Source
Figure 1
Figure 2
Figure 3
AI summary
Systems, methods and devices disclosed herein may include supportive interchange, a first compute device and a second compute device positioned on the supportive interchange, and a photonic integrated circuit positioned between the first compute device and the second compute device. The photonic integrated circuit may communicatively couple the first compute device and the second compute device. An optical fiber connection may couple to the photonic integrated circuit between the first compute device and the second compute device.