Co-Packaged Coherent Transceiver Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Contemporary optical communications systems rely on large and expensive coherent transceivers due to the separate packaging of components like lasers, optical modulators, photonic integrated circuits, modulator drivers, receiver transimpedance amplifiers, analog-to-digital converters, and digital signal processors.
Innovation Solution
Integration of all transceiver components except the laser into a single common carrier package, utilizing a package body with driver/transimpedance amplifier chips, application-specific integrated circuits, photonic integrated circuits, and a mast assembly for securing optical fibers, with etched regions for efficient optical coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If all transceiver components are integrated into a single package, then device size and cost are reduced, but thermal management becomes more difficult
Solution Approach 1:
The patent segments the transceiver components into two separate packages: a first package containing the laser and a second package containing all other components (modulator, photodetector, TIA, ADC, DSP). This segmentation allows the laser to be thermally managed separately from the other components, resolving the thermal management issue while achieving compact integration of the non-laser components in the second package.
2Temperature
If all transceiver components are separately packaged, then thermal management is easier, but device size and cost increase
Solution Approach 1:
The patent merges multiple transceiver components (modulator, photodetector, TIA, ADC, DSP) into a single integrated package, reducing the overall device size and cost. The laser is kept separate in its own package for thermal management purposes. This selective merging resolves the contradiction by combining components that benefit from integration while keeping thermally sensitive components separate.
3Ease of manufacture
If all transceiver components are integrated into a single package, then manufacturing cost is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent divides the transceiver into two separate packages to simplify manufacturing. The first package contains only the laser, while the second package contains all other components. This segmentation reduces packaging complexity compared to integrating all components in a single package, while still achieving cost savings through the integration of non-laser components in the second package.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This co-packaging approach results in a more compact, cost-effective transceiver design that maintains high performance while keeping the laser separately packaged for cooling purposes, addressing the size and expense issues of prior art systems.
Implementation Method 1
a etched region for optically coupling the optical fibers to a coupler integrated within the PIC
Data Source
AI summary
Disclosed herein are co-packaging structures, devices, and methods for integrating a photonic integrated circuit (PIC), an electronic integrated circuit including drivers and transimpedance amplifiers (TIAs) and an ASIC having analog-to-digital converters and a digital signal processor positioned on a common (the same) carrier thereby resulting in a compact coherent transceiver while lowering its cost.