Optical-Electrical Co-Packaging Layout for Lower Link Loss
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Solution Overview
Problem
The existing optical-electrical co-package structure has the optical-electrical conversion module and electrical chip located on the same surface of the package circuit board, leading to increased size, packaging costs, and high link loss due to the need for extensive inter-board traces for high-speed connections.
Innovation Solution
The optical-electrical co-package structure is redesigned with the optical-electrical conversion module and package circuit board placed on opposite sides of a carrier circuit board, using conductive vias for direct electrical connection, reducing the size of the package circuit board and minimizing high-speed link losses by eliminating the need for inter-board traces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the optical-electrical conversion module and electrical chip are located on the same surface of the package circuit board, then the connection between optical fiber and device can be implemented, but the size of the package circuit board increases
Solution Approach 1:
The patent transitions from a two-dimensional layout where both the optical-electrical conversion module and electrical chip are on the same surface to a three-dimensional stacked architecture. The optical-electrical conversion module is positioned on one side of the package circuit board while the electrical chip is positioned on the opposite side, utilizing the vertical dimension (Z-axis) to reduce the horizontal footprint of the package circuit board.
2Adaptability or versatility
If the optical-electrical conversion module and electrical chip are located on the same surface of the package circuit board, then the connection between optical fiber and device can be implemented, but the packaging costs increase
Solution Approach 1:
By stacking the optical-electrical conversion module and electrical chip on opposite sides of the package circuit board, the patent reduces the overall package size and minimizes the area of high-speed traces required, thereby reducing manufacturing complexity and packaging costs.
Solution Approach 2:
The patent extracts the optical-electrical conversion module from the same surface as the electrical chip, placing it on the opposite side of the package circuit board. This separation allows for independent optimization of each component's layout and reduces the interference between high-speed electrical signals and optical conversion processes.
3Adaptability or versatility
If the optical-electrical conversion module and electrical chip are located on the same surface of the package circuit board, then the connection between optical fiber and device can be implemented, but the link loss increases
Solution Approach 1:
The stacked architecture reduces the length of high-speed traces required to connect the optical-electrical conversion module and electrical chip by utilizing vertical connections through the package circuit board. This shorter path length directly reduces signal attenuation and link loss.
Solution Approach 2:
The patent replaces long horizontal trace paths with vertical through-hole via connections, substituting a mechanical routing approach that minimizes signal path length and reduces high-frequency signal loss.
Data Source
AI summary
The technology of this application relates to an optical-electrical co-package structure including a carrier circuit board, an optical-electrical conversion module, a package circuit board, and an electrical chip. The package circuit board and the optical-electrical conversion module are respectively located on a first side surface and a second side surface that are opposite to each other of the carrier circuit board. The electrical chip is disposed on the package circuit board, and the optical-electrical conversion module is separated from the package circuit board, to significantly reduce a size of the package circuit board, reduce processing difficulty and costs of the package circuit board, and reduce a loss of a high-speed signal transmission link. In addition, the carrier circuit board is provided with a first conductive via, and the package circuit board is electrically connected to the optical-electrical conversion module to reduce inter-board traces on a connection link between the optical-electrical conversion module and the package circuit board.