Co-support Module for Compact Microelectronic Assembly
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Solution Overview
Problem
Conventional microelectronic packages occupy excessive space due to large terminal areas, hindering compact arrangements necessary for advanced portable devices and data servers, and are limited in functional flexibility for interconnecting different types of microelectronic elements.
Innovation Solution
A modular circuit panel system with co-support contacts configured to connect with various microelectronic assemblies, allowing for flexible arrangement of command and address information transfer across different types of microelectronic elements, including DDRx and LPDDRx, through adjustable sampling rates and contact assignments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional microelectronic packages use large terminal areas for connections, then reliable electrical connections are achieved, but the package occupies excessive space on the circuit panel
Solution Approach 1:
The patent transitions from planar terminal arrangements to three-dimensional vertical interconnections using through-substrate vias and stacked chip architectures. This allows electrical connections to extend in the vertical dimension rather than requiring large horizontal terminal areas, thereby reducing the package footprint while maintaining connection reliability
Solution Approach 2:
The patent implements nested packaging where multiple chips are stacked vertically within a single package footprint. Smaller chips are positioned at different height levels and interconnected through vertical vias, allowing multiple functional elements to occupy the same planar area while maintaining reliable electrical connections through the stacked configuration
2Reliability
If conventional packages are designed for specific microelectronic element types, then optimized performance is achieved, but functional flexibility for interconnecting different types of elements is limited
Solution Approach 1:
The patent designs a universal package substrate with standardized through-substrate via patterns and interconnection architectures that can accommodate multiple types of microelectronic chips. The same package structure and connection methodology can be used with different chip types (e.g., logic chips, memory chips, sensors), providing functional flexibility while maintaining optimized performance through consistent electrical interconnection standards
Data Source
AI summary
A module is configured for connection with a microelectronic assembly having terminals and a microelectronic element. The module includes a circuit panel bearing conductors configured to carry command and address information, co-support contacts coupled to the conductors, and module contacts coupled to the conductors. The co-support contacts include first contacts having address and command information assignments arranged in a first predetermined arrangement for connection with a first type of microelectronic assembly in which the microelectronic element is configured to sample command and address information coupled thereto through the first contacts at a first sampling rate, and in a second predetermined arrangement for connection with a second type of the microelectronic assembly in which the microelectronic element is configured to sample the command and address information coupled thereto through a subset of the first contacts at a second sampling rate greater than the first sampling rate.