Carbon Dioxide Particle Injection for Semiconductor Cut Surface Refinement

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Solution Overview

Problem

Existing device manufacturing methods for semiconductor chips often result in shape abnormalities such as burrs and debris during cutting, leading to lower production yields and potential soldering defects due to uneven cut surfaces and degraded adhesive properties.

Innovation Solution

A device manufacturing method involving the injection of carbon dioxide particles onto cut surfaces to remove burrs and debris, utilizing the physical impact and cooling effect of dry ice to refine cut edges, thereby improving surface quality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If blade dicing is used to cut the semiconductor substrate and films, then the cutting process is simple and efficient, but shape abnormalities such as burrs occur at the cut portions

Engineering Contradiction:

Improvecutting efficiencyVSAvoidcut surface quality

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent replaces the purely mechanical blade dicing process with a hybrid approach that incorporates carbon dioxide particle impact. The particles are accelerated to strike the cut surfaces, removing burrs and debris through kinetic energy transfer and localized cooling, thereby substituting mechanical refinement with particle-based processing

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent utilizes the phase transition of carbon dioxide from solid particles to gas upon impact with the cut surfaces. This phase change absorbs heat and creates a localized cooling effect that prevents thermal damage while the expanding gas helps eject debris and burrs from the cut zones

Inventive Principle:

Principle #36Phase transitions

2Manufacturing precision

If laser irradiation is used to cut the substrate or film, then cutting precision is improved, but shape abnormalities such as debris occur at the cut portions

Engineering Contradiction:

Improvecut precisionVSAvoiddebris formation

Core Design Contradiction:

Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

The patent converts the harmful thermal effects of laser cutting that cause debris into beneficial effects by immediately following with carbon dioxide particle impact. The particles cool the heated zones, solidify melted material cleanly, and mechanically eject debris, thereby transforming the laser's harmful thermal side effects into a controlled processing advantage

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The carbon dioxide particles act as an intermediary between the laser cutting process and the final cut surface. They mediate the transition from a high-temperature, debris-generating laser cut to a clean, precise cut surface by cooling, cleaning, and refining the interface

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If burrs and debris are present at cut portions, then the external appearance test fails and soldering defects occur, but additional processing steps increase manufacturing complexity

Engineering Contradiction:

Improveproduct qualityVSAvoidprocess complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the cutting and surface refinement operations into a single integrated process step. The carbon dioxide particle impact occurs immediately after blade dicing or laser cutting without requiring separate burr removal operations, thereby combining multiple functions into one process stage

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method effectively reduces shape abnormalities, enhancing the external appearance and adhesive properties of semiconductor chips, thus increasing production yield and preventing soldering defects.

Implementation Method 1

injecting particles onto at least one of a first cut portion formed by the cutting of the substrate or a second cut portion formed by the cutting of the film, to process the at least one of the first cut portion or the second cut portion

Methodology Applied

Scientific EffectPhysical impact: Impact Force

Implementation Method 2

utilizing the physical impact and cooling effect of dry ice to refine cut edges

Methodology Applied

Scientific EffectCooling effect: Cooling

Data Source

PatentUS9633903B2Device manufacturing method of processing cut portions of semiconductor substrate using carbon dioxide particles

Publication Date: 2017.04.25 KK TOSHIBA

AI summary

A device manufacturing method according to an embodiment includes forming a film on the side of a second surface of a substrate having a first surface and the second surface, cutting the substrate, cutting the film, and injecting particles onto at least one of a first cut portion formed by the cutting of the substrate and a second cut portion formed by the cutting of the film, to process the at least one of the first cut portion or the second cut portion.