COA Substrate Via Alignment via Hollowed Flat Layer
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Solution Overview
Problem
The manufacturing of Color Filter on Array (COA) substrates faces challenges due to surface mismatches between the array substrate and the color film layer, leading to poor contact between the connection pattern and the signal wire lead, and requires additional masks for via formation in the insulation layer, increasing costs.
Innovation Solution
A COA substrate with a first conduction layer, insulation layer, second conduction layer, and flat layer, where the second via is formed within a hollowed-out region of the flat layer, allowing the connection pattern to extend through and connect to the signal wire lead without additional masks, simplifying the manufacturing process and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional COA substrate manufacturing process is used, then the color film layer is directly manufactured on the array substrate, but surface mismatches occur between the array substrate and the color film layer, leading to poor contact between the connection pattern and the signal wire lead
Solution Approach 1:
The patent introduces a flat layer as an intermediary component between the array substrate and the color film layer. This flat layer includes a hollowed-out region that accommodates the signal wire lead, allowing the connection pattern to make good contact with the signal wire lead while compensating for surface mismatches between the array substrate and color film layer.
2Ease of manufacture
If additional masks are used for via formation in the insulation layer, then via formation can be achieved, but manufacturing complexity and costs increase
Solution Approach 1:
The patent combines the via formation process with the flat layer patterning process. The hollowed-out region in the flat layer is formed simultaneously with the via in the insulation layer, eliminating the need for separate mask processes and reducing manufacturing complexity while maintaining proper via formation.
3Productivity
If the second via is formed without alignment to the first via, then manufacturing is simplified, but contact between connection pattern and signal wire lead may be poor
Solution Approach 1:
The hollowed-out region in the flat layer serves as a mediator that guides the alignment between the second via and the first via. The connection pattern extends through the hollowed-out region and the second via to contact the signal wire lead, ensuring proper alignment and contact while simplifying the manufacturing process.
Data Source
AI summary
The present disclosure relates to a COA substrate and a manufacturing method thereof, a display device. The COA substrate includes the following layers in a wiring region: a first conduction layer including a signal wire lead; an insulation layer having a first via to expose the signal wire lead; a second conduction layer including a first metal pattern with a second via; a flat layer having a hollowed-out region; and a connection pattern. The second via is at least in part located within the hollowed-out region, and orthographic projections of a border of a portion of the second via which is located within the hollowed-out region and a border of the first via on the base substrate overlap. The connection pattern extends through the first via and the second via and connects to the signal wire lead.