Coated Boron Nitride PCB Substrate Peel Strength
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Solution Overview
Problem
Printed circuit board substrates with thermally conductive particles like boron nitride face challenges in maintaining mechanical and adhesive properties due to low surface energy and inert surface chemistry, leading to reduced copper peel strength and thermal conductivity.
Innovation Solution
A printed circuit board substrate comprising a polymer matrix, a reinforcing layer, and coated boron nitride particles with an average coating thickness of 0.1 to 100 nanometers, which enhances peel strength and retains high Z-direction thermal conductivity by improving the filler-matrix interface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermally conductive particles like boron nitride are added to polymer matrices, then thermal conductivity is improved, but mechanical properties and adhesive strength are reduced
Solution Approach 1:
A silane coupling agent is used as an intermediary substance between the boron nitride particles and the polymer matrix. The silane coupling agent chemically bonds to both the inorganic boron nitride surface and the organic polymer matrix, creating a strong interfacial connection that improves mechanical properties and adhesive strength while maintaining thermal conductivity.
Solution Approach 2:
The invention creates a composite material system consisting of three components: boron nitride particles, silane coupling agent, and polymer matrix. This multi-component composite structure allows the system to simultaneously achieve high thermal conductivity from the boron nitride, strong adhesion from the silane coupling agent, and structural integrity from the polymer matrix.
2Temperature
If boron nitride particles are incorporated into the polymer, then heat dissipation is improved, but peel strength is reduced
Solution Approach 1:
The silane coupling agent acts as a mediator between the boron nitride particles and the polymer matrix, specifically improving the interfacial bonding that determines peel strength. The coupling agent's molecular structure allows it to bond to both surfaces, preventing particle-polymer interface failure under peeling forces while maintaining the thermal pathways provided by the boron nitride particles.
3Temperature
If inorganic fillers are added to achieve thermal conductivity, then thermal aging issues increase
Solution Approach 1:
The silane coupling agent serves as a protective intermediary layer between the inorganic boron nitride fillers and the polymer matrix. This interfacial layer prevents direct contact between incompatible materials, reducing chemical reactions and degradation that would otherwise occur during thermal aging, thereby improving long-term reliability and stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The coated boron nitride particles achieve a peel strength greater than 3 pli and maintain 90-99% of the Z-direction thermal conductivity of uncoated substrates, addressing thermal management challenges in miniaturized electronic devices.
Implementation Method 1
a plurality of coated boron nitride particles; wherein the plurality of coated boron nitride particles comprise a coating having an average coating thickness of 0.1 to 100 nanometers
Implementation Method 2
maintain 90-99% of the Z-direction thermal conductivity of uncoated substrates
Data Source
AI summary
In an embodiment, a printed circuit board substrate (12) comprises a polymer matrix; a reinforcing layer (42); and a plurality of coated boron nitride particles (44); wherein the plurality of coated boron nitride particles comprise a coating having an average coating thickness of 1 to 100 nanometers. The polymer matrix can comprise at least one of an epoxy, a polyphenylene ether, polystyrene, an ethylene-propylene dicyclopentadiene copolymer, a polybutadiene, a polyisoprene, a fluoropolymer, or a crosslinked matrix comprising at least one of triallyl cyanurate, triallyl isocyanurate, 1,2,4-trivinyl cyclohexane, trimethylolpropane triacrylate, or trimethylolpropane trimethacrylate.