Coated Organic Particles With Enthalpy-Controlled ALD Shell Formation
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Solution Overview
Problem
Existing encapsulation methods, such as atomic layer deposition (ALD), are limited in applicability to a narrow range of compounds, often causing degradation and agglomeration of particles, making them unsuitable for industrial-scale production of coated organic particles.
Innovation Solution
A process involving sequential contact of organic particles with metal- or semimetal-containing compounds and decomposition compounds in gaseous states, with controlled reaction enthalpies, to form a shell with uniform thickness and prevent agglomeration, applicable to a wide range of compounds including sensitive ones.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional atomic layer deposition is used to encapsulate organic compounds, then uniform coating and controlled release are achieved, but particle degradation and agglomeration occur
Solution Approach 1:
The patent changes the chemical parameters of the deposition process by using silane-based precursors instead of conventional metal alkyls, and by controlling the reaction enthalpy through selection of specific decomposition compounds. This parameter change allows the coating to form under milder conditions that preserve organic compound integrity while maintaining coating uniformity
Solution Approach 2:
The patent introduces decomposition compounds as intermediaries that mediate between the silane precursor and the organic compound surface. These decomposition compounds facilitate controlled surface modification without direct harsh interaction with the sensitive organic compound, preventing degradation while enabling uniform coating formation
2Manufacturing precision
If harsh conditions are used in atomic layer deposition to ensure coating formation, then coating completeness is improved, but particle agglomeration increases
Solution Approach 1:
The patent changes the thermal and chemical parameters by using silane precursors with lower reaction enthalpies and controlling decomposition conditions. This allows coating formation at milder temperatures and with less aggressive chemistry, preventing particle agglomeration while maintaining complete coating coverage through controlled surface reaction kinetics
3Ease of manufacture
If conventional ALD process is applied to sensitive organic compounds, then coating can be deposited, but compound degradation occurs
Solution Approach 1:
The patent uses decomposition compounds as intermediaries that react with silane precursors to form reactive species that can deposit coating material without directly contacting or degrading the sensitive organic compound. This intermediary mechanism enables coating deposition on sensitive compounds under mild conditions that preserve compound stability
Solution Approach 2:
The patent changes the chemical reactivity parameters by selecting silane-based precursors with controlled reaction enthalpies and matching decomposition compounds that activate under mild conditions. This parameter optimization allows coating deposition to proceed at lower temperatures and with less aggressive chemistry, preventing degradation of sensitive organic compounds
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The process achieves uniform coating with minimal particle agglomeration, preserving the integrity of the organic compounds and enabling scalable industrial production.
Implementation Method 1
sequentially contacting the organic particles with a first metal- or semimetal-containing compound and a first decomposition compound in the gaseous state
Implementation Method 2
the reaction enthalpy of the reaction of the first metal- or semimetal-containing compound with the first decomposition compound is lower than the reaction enthalpy of the reaction of the second metal- or semimetal-containing compound with the second decomposition compound
Data Source
AI summary
The present invention is in the field of coated organic particles, in particular comprising small molecules, by using atomic layer deposition. It relates to a process for preparing coated organic particles comprising the steps in the following order: (a) bringing particles containing an organic compound in motion to each other, (b) sequentially contacting the organic particles with a first metal- or semimetal-containing com-pound and a first decomposition compound in the gaseous state, and (c) sequentially contacting the organic particles with a second metal- or semimetal-containing compound and a second decomposition compound in the gaseous state, wherein the reaction enthalpy of the reaction of the first metal- or semimetal-containing com-pound with the first decomposition compound is lower than the reaction enthalpy of the reaction of the second metal- or semimetal-containing compound with the second decomposition com-pound.