Coated Plasma Chamber Components for Uniform Semiconductor Processing
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Solution Overview
Problem
Plasma processing systems face issues with process abnormalities and non-uniformities due to interactions between alloying elements in components and plasma chemistry, particularly in hydrogen plasmas, leading to impurities and process drift.
Innovation Solution
Applying a protective coating, such as an electroplated or anodized aluminum coating, to components in plasma processing systems to create a chemically uniform and inert surface that mitigates interactions with plasma species, thereby stabilizing the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If alloying elements are used in component materials to reduce cost or improve mechanical properties, then manufacturing cost or strength is improved, but process abnormalities and non-uniformities occur due to interactions with plasma chemistry
Solution Approach 1:
A coating layer is applied to the component surface to act as an intermediary between the bulk material and the plasma. This coating prevents direct interaction between plasma species and alloying elements in the bulk material, thereby eliminating process abnormalities while allowing the use of cost-effective or high-strength alloyed materials in the component bulk.
2Ease of manufacture
If alloying elements are present in components exposed to plasma, then material cost or mechanical properties are improved, but impurities and process drift occur
Solution Approach 1:
The coating serves as a protective intermediary that prevents plasma species from interacting with alloying elements in the bulk material. This eliminates the generation of impurities and process drift, ensuring high manufacturing precision in plasma processing while allowing the use of cost-effective alloyed materials for the component bulk.
3Ease of manufacture
If components are made from materials with high plasma reactivity, then less expensive materials can be used, but process stability deteriorates
Solution Approach 1:
The coating acts as a stable intermediary layer that presents a plasma-compatible surface to the plasma environment, while the bulk material can be made from less expensive, highly reactive alloys. This decoupling allows process stability to be maintained through the coating's inert surface while the bulk material provides cost-effective or high-strength properties.
4Reliability
If a coating is applied to the component surface, then plasma uniformity and process stability are improved, but device complexity increases
Solution Approach 1:
The invention changes the surface parameters of the component by applying a coating with specific properties (plasma compatibility, chemical inertness). This parameter change at the surface level achieves plasma uniformity and process stability without fundamentally altering the overall component design or system architecture, thus minimizing the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The coating reduces process drift, improves plasma uniformity, increases component longevity, and allows the use of less expensive materials by decoupling bulk material properties from plasma-facing surfaces, enhancing within-wafer uniformity and wafer-to-wafer repeatability.
Implementation Method 1
the coating is configured to be exposed to a plasma during processing of a workpiece
Implementation Method 2
implementing a deposition process to a component of a plasma processing system to provide a coating on a surface of the component
Data Source
AI summary
Systems and methods for plasma processing of a semiconductor workpiece are provided. In one example, a plasma processing system includes a plasma chamber. The plasma processing system includes an inductive coil disposed about the plasma chamber. The plasma processing system includes a processing chamber downstream of the plasma chamber. The plasma processing system includes a workpiece support in the processing chamber. The plasma processing system includes a component with a coating in the processing chamber, the plasma chamber, or between the processing chamber and the plasma chamber.