Polymer-Coated Substrate Laser Cutting With Controlled Crack Paths

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Solution Overview

Problem

Coatings on substrates interfere with laser cutting processes by absorbing laser energy, leading to unpredictable crack propagation, increased debris, and subsurface damage, making precise separation difficult.

Innovation Solution

A method involving the use of an ablative laser beam to remove targeted portions of the polymer coating in a predetermined pattern, allowing a cutting laser beam to separate the coated substrate along a controlled damage track without contacting the remaining coating, thereby minimizing debris and defects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a coating is applied to the substrate surface, then the substrate gains protective or functional properties, but the laser cutting process effectiveness deteriorates due to energy absorption

Engineering Contradiction:
Improvesubstrate protectionVSAvoidlaser cutting precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The coating removal process uses segmented pulsed laser beams that selectively remove coating material in a controlled manner, creating a damage track through the substrate while leaving the rest of the coating intact for protection

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The laser cutting process applies localized energy delivery to specific regions where coating removal is needed, maintaining different properties in different areas: removed coating at the cut line, intact coating elsewhere for protection

Inventive Principle:
Principle #3Local quality

2Productivity

If the laser beam directly cuts through the coated substrate, then cutting speed is maintained, but crack propagation becomes unpredictable and debris increases

Engineering Contradiction:
Improvecutting speedVSAvoidcrack propagation control
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The process first removes the coating material before cutting, creating a predetermined damage track that guides subsequent crack propagation. This preliminary coating removal ensures predictable crack paths and reduced debris during the actual cutting phase

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The damage track acts as an intermediary structure that mediates between the laser beam and the substrate, providing a controlled path for crack propagation that prevents unpredictable cracking and debris formation

Inventive Principle:
Principle #24Intermediary (Mediator)

3Use of energy by moving object

If the laser energy is delivered through the coating, then the coating provides initial energy absorption, but the damage track quality deteriorates due to reduced energy reaching the substrate

Engineering Contradiction:
Improvelaser energy utilizationVSAvoiddamage track quality
Core Design Contradiction:
Use of energy by moving objectVSManufacturing precision

Solution Approach 1:

The process converts the harmful effect of coating energy absorption into a beneficial preliminary step: the coating's energy absorption capability is used to selectively remove the coating material itself, creating the damage track without compromising the quality of the subsequent substrate cutting

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables precise and controlled separation of coated substrates with reduced debris and subsurface damage, maintaining the integrity of the substrate by confining crack propagation to the intended damage track.

Implementation Method 1

removing a target portion of a polymer coating by directing an ablative laser beam to the target portion

Methodology Applied
Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

directing a cutting laser beam along the predetermined coating removal pattern... and separating the coated substrate into at least two coated parts

Methodology Applied
Scientific EffectLaser-induced fracture: Fracture Mechanics

Data Source

PatentEP3359324B1Method of laser cutting a coated substrate
Publication Date: 2021.11.17 CORNING INC
  • EP3359324B1 patent drawingFigure 1
  • EP3359324B1 patent drawingFigure 2
  • EP3359324B1 patent drawingFigure 3A~3B

AI summary

A method of laser preparation of a coated substrate (10, 12) to be laser cut is provided. The method includes removing a target portion of a polymer coating (12) from a coated substrate (10, 12) by directing an ablative laser beam to the target portion, wherein the target portion of the polymer coating (12) has a width of between about 10 μm and about 6.0 mm.