Coated Substrate with Negative Slope Walls for Uniform Organic Layers
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Solution Overview
Problem
The manufacturing of organic electronic devices is challenging due to difficulties in coating over low energy surfaces, leading to issues like void formation, poor wetting, and electrical shorting, which affect the performance and efficiency of these devices.
Innovation Solution
The use of containment structures with a substrate having walls with a negative slope and layers with specific surface energies, along with a method involving the deposition of a first layer with a surface energy of 30 mN/m or less and a second layer formed by evaporating a liquid composition, enables improved wetting and uniform coating on low energy surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional coating methods are used on low energy surfaces, then coating process is simple, but coating uniformity is poor and voids form
Solution Approach 1:
The substrate surface is pre-treated with plasma or chemical treatments before coating to modify surface energy and improve wetting characteristics. This preliminary action prepares the low energy surface to accept uniform coating deposition, preventing void formation while maintaining process feasibility
Solution Approach 2:
An intermediary layer or surface treatment agent is introduced between the low energy substrate and the coating material. This intermediary modifies the surface properties temporarily during coating deposition, enabling uniform coverage without requiring complex equipment changes
2Reliability
If coating is applied over low energy surfaces, then manufacturing process is straightforward, but electrical shorting occurs
Solution Approach 1:
The surface energy parameters of the substrate are modified through plasma treatment, chemical etching, or surface coating to transform the low energy surface into a high energy surface. This parameter change ensures proper wetting and prevents coating defects that could lead to electrical shorting, while the treatment processes remain industrially standard
3Manufacturing precision
If standard coating methods are used, then process time is short, but wetting is poor
Solution Approach 1:
Quick plasma treatment or surface activation is performed immediately before coating deposition to temporarily enhance surface energy and wetting properties. This preliminary action creates a time-sensitive window for optimal coating application, ensuring good wetting quality without adding significant process time
Solution Approach 2:
Physical or chemical surface activation methods replace extended mechanical coating processes. By pre-modifying the surface properties, the actual coating deposition can be performed quickly with standard equipment, achieving both good wetting and efficient processing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the formation of uniform organic layers, reduces voids, and prevents electrical shorting, thereby improving the performance and efficiency of organic electronic devices by ensuring complete and uniform film formation on low energy surfaces.
Implementation Method 1
a first layer deposited in the space having a first surface energy no greater than 30 mN/m
Implementation Method 2
a second layer formed by evaporating a liquid composition
Data Source
AI summary
Provided are containment structures having a substrate structure having a plurality of walls extending from a surface to define a space, wherein at least one of the walls has an overall negative slope; a first layer deposited in the space having a first surface energy no greater than 30 mN/m; and a second layer deposited on top of the first layer.