Coated Support Unit Structure to Minimize Plasma Etching Damage
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Solution Overview
Problem
In semiconductor manufacturing, the etching process during plasma etching can lead to the etching of the support unit's bonding unit, resulting in decreased cooling efficiency, temperature unevenness, and subsequent issues such as substrate yield defects, shortened support unit lifespan, and increased equipment operating costs.
Innovation Solution
A substrate treating apparatus and manufacturing method that include a support unit with a body having a step structure, surrounded by a first coating layer formed by thermal spray coating, a bonding unit, a second coating layer with higher hardness and density formed by atomic layer deposition, and a puck on the upper surfaces of the bonding unit and second coating layer, minimizing etching of the support unit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the support unit and ring assembly are separate components, then the structure is simple and easy to manufacture, but a gap forms between them causing the bonding unit to be etched
Solution Approach 1:
The patent merges the support unit and ring assembly into a single integrated component, eliminating the gap between them. The ring assembly is formed as an extension of the support unit's body, ensuring continuous contact with the bonding unit and preventing etching exposure while maintaining manufacturing simplicity through integrated construction.
Solution Approach 2:
The patent employs composite material structure where the support unit body is made of aluminum and coated with ceramic materials (such as aluminum oxide or yttrium oxide) through atomic layer deposition. This composite structure provides both mechanical support and etching resistance, solving the contradiction between ease of manufacture and etching resistance.
2Manufacturing precision
If the bonding unit is directly etched or the band is etched, then the bonding unit becomes exposed, but cooling efficiency decreases and temperature unevenness occurs
Solution Approach 1:
The patent applies ceramic coating layers (aluminum oxide, yttrium oxide) on the aluminum support unit body. These ceramic materials provide high etching resistance while maintaining thermal conductivity, ensuring that the bonding unit remains protected and cooling efficiency is preserved, thus preventing temperature unevenness.
Solution Approach 2:
The patent changes the physical and chemical parameters of the support unit surface by applying ceramic coatings with specific hardness, density, and etching resistance properties. This modifies the surface characteristics to resist fluorine gas etching while maintaining the underlying aluminum's thermal properties for effective cooling.
3Productivity
If the bonding unit is etched, then the etching process completes, but the support unit lifespan shortens and equipment operating cost increases
Solution Approach 1:
The patent uses composite material construction with ceramic coatings on the aluminum support unit. The ceramic layer (aluminum oxide or yttrium oxide) provides superior etching resistance, allowing the support unit to withstand repeated etching cycles without degradation, thereby extending lifespan and reducing replacement frequency and operating costs.
Solution Approach 2:
The patent applies protective ceramic coating layers in advance on the support unit body before the etching process begins. This pre-protection cushioning prevents the bonding unit from being etched during operation, ensuring the support unit maintains its structural integrity and functionality throughout its service life.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively minimizes etching of the support unit, reducing substrate yield defects and increasing the lifespan of the support unit, while also reducing equipment operating costs by maintaining cooling efficiency and preventing temperature unevenness.
Implementation Method 1
forming a first coating layer from the first level to a height of a fourth level higher than the third level by a thermal spray coating (TSC) method so as to surround the body
Implementation Method 2
forming a second coating layer on the first coating layer, the second coating layer having a smaller thickness than the bonding unit and higher hardness than the first coating layer
Implementation Method 3
a chamber having a treating space in which a process of plasma-etching a substrate is performed
Data Source
AI summary
A manufacturing method of a substrate treating apparatus includes: preparing a body having a lower end provided at a first level, having a step formed at a second level higher than the first level, and having an upper end provided at a third level higher than the second level; forming a first coating layer from the first level to a height of a fourth level higher than the third level by a thermal spray coating (TSC) method so as to surround the body; forming a bonding unit from an upper surface of the body to the fourth level; forming a second coating layer on the first coating layer, the second coating layer having a smaller thickness than the bonding unit and higher hardness than the first coating layer; and providing a puck on upper surfaces of the bonding unit and the second coating layer.